Patent Application Titled "Semiconductor Device and Method of Forming Conductive Ink Layer as Interconnect Structure between Semiconductor Packages" Published Online
The assignee for this patent application is
Reporters obtained the following quote from the background information supplied by the inventors: "Semiconductor devices are commonly found in modern electronic products. Semiconductor devices vary in the number and density of electrical components. Discrete semiconductor devices generally contain one type of electrical component, e.g., light emitting diode (LED), small signal transistor, resistor, capacitor, inductor, and power metal oxide semiconductor field effect transistor (MOSFET). Integrated semiconductor devices typically contain hundreds to millions of electrical components. Examples of integrated semiconductor devices include microcontrollers, microprocessors, charged-coupled devices (CCDs), solar cells, and digital micro-mirror devices (DMDs).
"Semiconductor devices perform a wide range of functions such as signal processing, high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity, and creating visual projections for television displays. Semiconductor devices are found in the fields of entertainment, communications, power conversion, networks, computers, and consumer products. Semiconductor devices are also found in military applications, aviation, automotive, industrial controllers, and office equipment.
"Semiconductor devices exploit the electrical properties of semiconductor materials. The atomic structure of semiconductor material allows its electrical conductivity to be manipulated by the application of an electric field or base current or through the process of doping. Doping introduces impurities into the semiconductor material to manipulate and control the conductivity of the semiconductor device.
"A semiconductor device contains active and passive electrical structures. Active structures, including bipolar and field effect transistors, control the flow of electrical current. By varying levels of doping and application of an electric field or base current, the transistor either promotes or restricts the flow of electrical current. Passive structures, including resistors, capacitors, and inductors, create a relationship between voltage and current necessary to perform a variety of electrical functions. The passive and active structures are electrically connected to form circuits, which enable the semiconductor device to perform high-speed calculations and other useful functions.
"Semiconductor devices are generally manufactured using two complex manufacturing processes, i.e., front-end manufacturing, and back-end manufacturing, each involving potentially hundreds of steps. Front-end manufacturing involves the formation of a plurality of die on the surface of a semiconductor wafer. Each semiconductor die is typically identical and contains circuits formed by electrically connecting active and passive components. Back-end manufacturing involves singulating individual semiconductor die from the finished wafer and packaging the die to provide structural support and environmental isolation. The term 'semiconductor die' as used herein refers to both the singular and plural form of the words, and accordingly can refer to both a single semiconductor device and multiple semiconductor devices.
"One goal of semiconductor manufacturing is to produce smaller semiconductor devices. Smaller devices typically consume less power, have higher performance, and can be produced more efficiently. In addition, smaller semiconductor devices have a smaller footprint, which is desirable for smaller end products. A smaller semiconductor die size can be achieved by improvements in the front-end process resulting in semiconductor die with smaller, higher density active and passive components. Back-end processes may result in semiconductor device packages with a smaller footprint by improvements in electrical interconnection and packaging materials.
"A common semiconductor device arrangement includes a upper semiconductor package stacked over a lower semiconductor package, i.e. package-on-package (PoP). The upper semiconductor package is typically electrically connected to the lower semiconductor package with bumps. The interconnect bumps are bonded to an interconnect structure on the lower semiconductor package. The interconnect bumps add height to the PoP arrangement and can lead to warpage of the semiconductor device."
In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "A need exists for an interconnect structure for PoP with reduced package height and better warpage control. Accordingly, in one embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a semiconductor die, depositing an encapsulant over and around the semiconductor die, forming an opening in a first surface of the encapsulant, forming a bump recessed within the opening of the encapsulant, forming a conductive ink over the first surface of the encapsulant, bump, and sidewall of the opening, and forming an interconnect structure over a second surface of the encapsulant opposite the first surface of the encapsulant.
"In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a semiconductor die, depositing an encapsulant over the semiconductor die, forming an opening in a first surface of the encapsulant, forming a first interconnect structure recessed within the opening of the encapsulant, and forming a conductive layer over the first surface of the encapsulant and first interconnect structure.
"In another embodiment, the present invention is a method of making a semiconductor device comprising the steps of providing a first semiconductor package including a recessed interconnect structure, and forming conductive ink over a surface of the first semiconductor package including the recessed interconnect structure.
"In another embodiment, the present invention is a semiconductor device comprising a first semiconductor package including a recessed interconnect structure. Conductive ink is formed over a surface of the first semiconductor package including the recessed interconnect structure.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 illustrates a printed circuit board (PCB) with different types of packages mounted to its surface;
"FIGS. 2a-2c illustrate further detail of the representative semiconductor packages mounted to the PCB;
"FIGS. 3a-3c illustrate a semiconductor wafer with a plurality of semiconductor die separated by a saw street;
"FIGS. 4a-4l illustrate a process of forming a conductive ink layer as a package interconnect structure in fcPoP MLP; and
"FIGS. 5a-5l illustrate a process of forming a conductive ink layer as a package interconnect structure in eWLB MLP."
For more information, see this patent application: Yoon, Insang;
Keywords for this news article include: Electronics, Semiconductor,
Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC
Most Popular Stories
- National Retail Federation Reduces Sales Forecast
- Execs Help Entrepreneurs, Get Chevy Volts
- Amazon Hiring on Calif.'s Central Coast
- Pandora Tumbles in Late Trading
- Sporty Ford Fiesta Fires on All 3 Cylinders
- Prison Workers Wanted
- Zillow in Reported $2B Bid for Real Estate Rival Trulia
- Jennifer Lopez Throws Big Bash for Birthday
- Small Firms Take Out the Trash in Jersey
- Citigroup Unit Paying $5 Million to Settle SEC Charges