News Column

Patent Issued for Substrate for Semiconductor Package and Semiconductor Package Having the Same

April 30, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- According to news reporting originating from Alexandria, Virginia, by VerticalNews journalists, a patent by the inventor Suh, Min Suk (Seoul, KR), filed on September 25, 2012, was published online on April 15, 2014.

The assignee for this patent, patent number 8698283, is SK Hynix Inc. (Gyeonggi-do, KR).

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates generally to semiconductor packages, and more particularly to a substrate for a semiconductor package and a semiconductor package having the same.

"Nowadays, semiconductor chips capable of storing massive data in a short processing time and semiconductor packages having such semiconductor chips packaged therein are being developed.

"To enhance the data storing capacity and/or the data processing speed of a semiconductor package, a semiconductor package having a plurality of electrically interconnected semiconductor packages stacked on a substrate is also being developed.

"When semiconductor packages are stacked into a single semiconductor package unit, problems hindering high-speed operations could arise in the single semiconductor package unit due to the different signal path lengths between any respective combination of the stacked semiconductor packages in the single semiconductor package unit."

In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventor's summary information for this patent: "Embodiments of the present invention are directed to a substrate for a semiconductor package which reduces the difference in the path lengths of signals applied to a plurality of semiconductor chips thereby enhancing operation properties.

"Also, embodiments of the present invention are directed to a semiconductor package which includes a substrate for a semiconductor package that enhances the operation properties of semiconductor chips.

"In one embodiment, a substrate for a semiconductor package includes a substrate body having a first face and a second face opposing the first face; a through electrode passing through the substrate body between the first face and the second face; an insulation member with a block shape disposed over the first face; and a connection member having a first conductive unit disposed inside of the insulation member and electrically connected to the through electrode and a second conductive unit electrically connected to the first conductive unit and exposed at both side faces of the insulation member.

"The substrate body may include a semiconductor chip having a circuit unit and a bonding pad electrically connected with the through electrode.

"Alternatively, the substrate body may include a printed circuit board.

"The substrate for a semiconductor package may further include a conductive ball disposed over the second face of the substrate body and electrically connected to the through electrode.

"The substrate for a semiconductor package may further include an additional connection member disposed at an end portion of the second conductive unit exposed from the insulation member.

"The insulation member includes a first insulation unit and a second insulation unit disposed over the first insulation unit, the first conductive unit passes through the first insulation unit, and the second conductive unit is disposed over the first insulation unit.

"The first conductive unit is disposed vertically to the first face and the second conductive unit is disposed parallel to the first face.

"In another embodiment, a semiconductor package includes a substrate having a substrate body with a first face and a second face opposing the first face, a first through electrode passing through the substrate body between the first face and the second face; an insulation member with a block shape disposed over the first face, and a connection member having a first conductive unit disposed inside of the insulation member and electrically connected to the first through electrode and a second conductive unit electrically connected to the first conductive unit and exposed from both side faces of the insulation member; and a semiconductor chip having third and fourth faces disposed over the first face of the substrate body vertically to the first face and being opposite to each other, and a second through electrode passing through the semiconductor chip between the third and fourth faces and electrically connected to the second conductive unit exposed from the side face of the insulation member.

"The substrate body includes one of a semiconductor chip having a circuit unit and a bonding pad electrically connected to the first through electrode, and a printed circuit board.

"The substrate body includes a conductive ball disposed over the second face of the substrate body and electrically connected to the first through electrode.

"The semiconductor package may further include an additional connection member for electrically connecting the second through electrode and the second conductive unit.

"The insulation member includes a first insulation unit and a second insulation unit disposed over the first insulation unit, the first conductive unit passes through the first insulation unit, and the second conductive unit is disposed over the first insulation unit.

"The semiconductor package may further include a sealing member for sealing the semiconductor chip.

"The semiconductor package may further include an adhesive member interposed between a side face of the semiconductor chip and the first face so as to attach the semiconductor chip onto the first face.

"At least two semiconductor chips are disposed over the first face, and the semiconductor chips are of the same kind of semiconductor chips.

"Alternatively, at least two semiconductor chips are disposed over the first face, and the semiconductor chips are of different kind of semiconductor chips."

For more information, see this patent: Suh, Min Suk. Substrate for Semiconductor Package and Semiconductor Package Having the Same. U.S. Patent Number 8698283, filed September 25, 2012, and published online on April 15, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=69&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3434&f=G&l=50&co1=AND&d=PTXT&s1=20140415.PD.&OS=ISD/20140415&RS=ISD/20140415

Keywords for this news article include: Electronics, Circuit Board, SK Hynix Inc., Semiconductor.

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Source: Electronics Newsweekly