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Freescale Semiconductor Assigned Patent for Encapsulant for Semiconductor Device

February 7, 2014

By Targeted News Service

ALEXANDRIA, Va., Feb. 7 -- Freescale Semiconductor, Austin, Texas, has been assigned a patent (8,643,197) developed by four co-inventors for "encapsulant for a semiconductor device." The co-inventors are Sheila F. Chopin, Round Rock, Texas, Varughese Mathew, Austin, Texas, Leo M. Higgins III, Austin, Texas, and Chu-Chung Lee, Round Rock, Texas.

The patent application was filed on Oct. 15, 2012 (13/651,995). The full-text of the patent can be found at

Written by Balkishan Dalai; edited by Jaya Anand.


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Source: Targeted News Service

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