News Column

"Electronic Device Console with Natural Draft Cooling" in Patent Application Approval Process

February 13, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- A patent application by the inventors BODENWEBER, Paul F. (Kingston, NY); CASEY, Jon A. (Poughkeepsie, NY); LIAN, Chenzhou (Poughquag, NY); RIVERA, Kathryn C. (Hopewell Junction, NY); SIKKA, Kamal K. (Poughkeepsie, NY), filed on July 18, 2012, was made available online on January 30, 2014, according to news reporting originating from Washington, D.C., by VerticalNews correspondents.

This patent application is assigned to International Business Machines Corporation.

The following quote was obtained by the news editors from the background information supplied by the inventors: "Cooling an electronic chip package in an electronic device, e.g., a gaming console, projector, etc., may be accomplished using forced convection in which a fan blows air over the chip package and/or a heat sink connected to the chip package. A fan refers to any mechanism that uses motive force to move air, and can also be referred to as a forced air mechanism. While forced air convection systems generally provide sufficient cooling capacity for the chip package, fans have some undesirable qualities. For example, fans consume power, generate audible noise, cause vibration which may damage components in the electronic device, and can lead to overheating and failure of components in the electronic device in the event that the fan fails to operate.

"Cooling an electronic chip package in an electronic device may be accomplished without using a fan by utilizing other heat transfer mechanisms, such as natural convection. Such approaches typically involve attaching a passive heat sink to the electronic chip package. However, natural convection cooling systems that do not utilize a fan typically have less cooling capacity than those that do use a fan, since convective heat transfer increases with increasing velocity of a moving fluid. This reduced cooling capacity can result in the chip in the electronic chip package operating at higher temperatures, which can affect the functional frequency and/or reliability of the chip

"Accordingly, there exists a need in the art to overcome the deficiencies and limitations described hereinabove."

In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventors' summary information for this patent application: "In a first aspect of the invention, there is an electronic device console that includes a console body that houses a chip package. The electronic device console also includes a duct extending from the console body, wherein an interior volume of the duct is in fluid communication with an interior volume of the console body. The electronic device console additionally includes a first vent at a distal end of the duct, and a second vent in a wall of the console body. The console is structured and arranged to be oriented in a first orientation and a second orientation. The duct functions as a chimney for natural convection cooling of the chip package when the console is oriented in the first orientation. The console body functions as a chimney for natural convection cooling of the chip package when the console is oriented in the second orientation.

"In another aspect of the invention, there is an electronic device console including: a console body that houses a chip package; and a duct connected to the console body, wherein an interior volume of the duct is in fluid communication with an interior volume of the console body. The console also includes: a first vent at a distal end of the duct that places the interior volume of the duct in fluid communication with an ambient environment outside the console; and a second vent in a wall of the console body that places the interior volume of the console body in fluid communication with the ambient environment. The console is structured and arranged to be oriented in a first orientation and a second orientation. The chip package is cooled via natural convection cooling without using a fan that is inside or attached to the console. The duct provides a first chimney effect to the natural convection cooling of the chip package when the console is oriented in the first orientation. The console body provides a second chimney effect to the natural convection cooling of the chip package when the console is oriented in the second orientation.

"In yet another aspect of the invention, there is a method of manufacturing an electronic device console. The method includes forming the console comprising a console body, a duct extending from the console body, a first vent at a distal end of the duct, and a second vent in the console body. The method also includes housing a chip package in the console body. The console is structured and arranged to be oriented in a first orientation and a second orientation. The chip package is cooled via natural convection cooling without using a fan that is inside or attached to the console. The duct provides a first chimney effect to the natural convection cooling of the chip package when the console is oriented in the first orientation. The console body provides a second chimney effect to the natural convection cooling of the chip package when the console is oriented in the second orientation.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

"The present invention is described in the detailed description which follows, in reference to the noted plurality of drawings by way of non-limiting examples of exemplary embodiments of the present invention.

"FIGS. 1-8 are views of an electronic device console in accordance with aspects of the invention; and

"FIG. 9 is a graph showing power dissipation of various systems as a function of junction temperature in accordance with aspects of the invention."

URL and more information on this patent application, see: BODENWEBER, Paul F.; CASEY, Jon A.; LIAN, Chenzhou; RIVERA, Kathryn C.; SIKKA, Kamal K. Electronic Device Console with Natural Draft Cooling. Filed July 18, 2012 and posted January 30, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=1814&p=37&f=G&l=50&d=PG01&S1=20140123.PD.&OS=PD/20140123&RS=PD/20140123

Keywords for this news article include: International Business Machines Corporation.

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Source: Politics & Government Week


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