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Researchers Submit Patent Application, "Mounting Structure of Semiconductor Device and Method of Manufacturing the Same", for Approval

February 12, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors SEKIDO, Takanori (Tokyo, JP); MIKAMI, Masato (Tokyo, JP), filed on July 1, 2013, was made available online on January 30, 2014.

No assignee for this patent application has been made.

News editors obtained the following quote from the background information supplied by the inventors: "The disclosure relates to a mounting structure of a semiconductor device and a method of manufacturing the same.

"In recent years, medical and industrial endoscopes have been widely used. In an exemplary medical endoscope, an image pickup device such as a CCD is built in a distal end of a body insertion portion. Lesions can be observed by deeply inserting the insertion portion into the body, and testing and treatment of the body can be performed by using together with a treatment instrument as needed. In the endoscope, there is a need to achieve a small-sized distal hard portion in which a semiconductor device is built.

"In order to achieve a compact semiconductor device, various methods of mounting electronic components have been proposed. For example, there is disclosed a semiconductor device where a flexible board has an electrode on one surface and an external electrode on the other surface. The flexible board is bent to cover a plurality of electronic components, and after an inner portion thereof is sealed with a resin, the flexible board is mounted so as to be parallel to a motherboard (see, for example, Japanese Laid-open Patent Publication No. 2001-077294)."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "In accordance with some embodiments, a mounting structure of a semiconductor device and a method of manufacturing the same are presented.

"In some embodiments, a semiconductor-device mounting structure includes a first semiconductor device and a plate-shaped second semiconductor device connected to the first semiconductor device. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The flexible portion is bent at a boundary with the hard portion, along a shape of the electronic component such that the flexible board covers the electronic component. The flexible board and the electronic component are sealed with the sealing resin. The first semiconductor device is mounted vertical to the second semiconductor device such that the hard portion is parallel to the second semiconductor device.

"In some embodiments, a method of manufacturing a semiconductor-device mounting structure including a first semiconductor device and a plate-shaped second semiconductor device is presented. The first semiconductor device includes a flexible board, an electronic component, and a sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The method includes: connecting the electronic component to the flexible portion with solder by using a reflow method; applying the sealing resin to an entire surface of the flexible board and a lower portion of the electronic component; bending the flexible portion along a shape of the electronic component such that the flexible board covers the electronic component, and then preliminarily fixing the first semiconductor device with a jig; heating the preliminarily-fixed first semiconductor device in a furnace to cure the sealing resin; and mounting the cured first semiconductor device vertical to the second semiconductor device such that the hard portion is parallel to the second semiconductor device, and connecting the first semiconductor device to the second semiconductor device.

"In some embodiments, a method of manufacturing a semiconductor-device mounting structure including a first semiconductor device and a plate-shaped second semiconductor device is presented. The first semiconductor device includes a flexible board, an electronic component, and a first sealing resin. The flexible board includes a bendable flexible portion and a hard portion. The method includes: connecting the electronic component to the flexible portion; applying a second sealing resin, which is softer than the first sealing resin that is a UV-curable thermosetting resin, to the hard portion; after applying the second sealing resin, irradiating the second sealing resin with UV light to enter into a B stage state; applying the first sealing resin to the flexible portion and a lower portion of the electronic component; bending the flexible portion along a shape of the electronic component such that the flexible board covers the electronic component, and preliminarily fixing the first semiconductor device with a jig; heating the preliminarily-fixed first semiconductor device in a furnace to cure the first sealing resin and the second sealing resin; and mounting the cured first semiconductor device vertical to the second semiconductor device such that the hard portion is parallel to the second semiconductor device, and electrically connecting the electronic component to the second semiconductor device.

"The above and other features, advantages and technical and industrial significance of this invention will be better understood by reading the following detailed description of presently preferred embodiments of the invention, when considered in connection with the accompanying drawings.

BRIEF DESCRIPTION OF DRAWINGS

"FIG. 1 is a schematic cross-sectional view of a semiconductor-device mounting structure according to a first embodiment of the present invention;

"FIGS. 2A to 2D are schematic views for describing a manufacturing process of the semiconductor-device mounting structure according to the first embodiment of the present invention;

"FIG. 3 is a flowchart for describing the manufacturing process of the semiconductor-device mounting structure according to the first embodiment of the present invention;

"FIG. 4 is a schematic cross-sectional view of a semiconductor-device mounting structure according to a second embodiment of the present invention,

"FIG. 5 is a flowchart for describing a manufacturing process of the semiconductor-device mounting structure according to the second embodiment of the present invention;

"FIGS. 6A to 6D are schematic views for describing the manufacturing process of the semiconductor-device mounting structure according to the second embodiment of the present invention;

"FIG. 7 is a schematic cross-sectional view of a semiconductor-device mounting structure according to a third embodiment of the present invention;

"FIG. 8 is a schematic cross-sectional view of a semiconductor-device mounting structure according to a fourth embodiment of the present invention;

"FIGS. 9A to 9D are schematic views for describing a manufacturing process of the semiconductor-device mounting structure according to the fourth embodiment of the present invention;

"FIG. 10 is a schematic cross-sectional view of a semiconductor-device mounting structure according to a fifth embodiment of the present invention;

"FIGS. 11A to 11D are schematic views for describing a manufacturing process of the semiconductor-device mounting structure according to the fifth embodiment of the present invention;

"FIG. 12 is a schematic cross-sectional view of a semiconductor-device mounting structure according to a sixth embodiment of the present invention; and

"FIGS. 13A to 13C are schematic views for describing a manufacturing process of the semiconductor-device mounting structure according to the sixth embodiment of the present invention."

For additional information on this patent application, see: SEKIDO, Takanori; MIKAMI, Masato. Mounting Structure of Semiconductor Device and Method of Manufacturing the Same. Filed July 1, 2013 and posted January 30, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4653&p=94&f=G&l=50&d=PG01&S1=20140123.PD.&OS=PD/20140123&RS=PD/20140123

Keywords for this news article include: Patents, Treatment, Semiconductor, Electronic Components.

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Source: Electronics Newsweekly


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