The patent's assignee is
News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to lead frame structures and methods for manufacturing the same, and more particularly, lead frame structures of light-emitting diodes (LEDs) and methods for manufacturing LED lead frames.
"Recently, with the progression of the industry and commerce and the advancements in human society, the products on the market are aimed to be convenient, accurate, and economical. Therefore, the products that are developed are better than the old products and make contributions to the society.
"Light-emitting diodes (LEDs) are semiconductor devices capable of emitting light. Appearing as practical electronic components in 1962, early LEDs emitted low-intensity red light, but modern versions are available across the visible, ultraviolet, and infrared wavelengths, with very high brightness. With the development of white LEDs, the application of LEDs goes from indicators and display boards to illumination.
"When a light-emitting diode is forward-biased, electrons are able to recombine with electron holes within the device, releasing energy in the form of photons. This effect is called electroluminescence and the color of the light is determined by species of semiconductor materials and artificially introduced dopants. LEDs present many advantages over conventional light sources including lower energy consumption, longer lifetime, improved physical robustness, faster response, and high reliability.
"However, as illustrated in FIG. 1, in conventional methods for the manufacturing of LED lead frames, the insulating casing 110 tends to crack (indicated by oblique lines) when the product undergoes material release. Therefore, the yield rate is decreased, and the production capacity is hampered.
"In view of the foregoing, there exist problems and disadvantages in the current manufacturing methods that await further improvement. However, those skilled in the art sought vainly for a solution. In order to solve or circumvent above problems and disadvantages, there is an urgent need in the related field to avoid the crack of the insulating casing."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "The following presents a simplified summary of the disclosure in order to provide a basic understanding to the reader. This summary is not an extensive overview of the disclosure and it does not identify key/critical elements of the present invention or delineate the scope of the present invention. Its sole purpose is to present some concepts disclosed herein in a simplified form as a prelude to the more detailed description that is presented later.
"In view of the foregoing, one aspect of the present disclosure is directed to a method for manufacturing an LED lead frame, and an LED lead frame structure, in which the crack of the insulating casing is substantially avoided.
"According to one embodiment of the present disclosure, the method for manufacturing an LED lead frame includes the steps of: providing a metal substrate; forming multiple lead areas on the metal substrate, and forming two slug holes on two opposite sides of each lead area; forming an insulating casing on each lead area; when stamping each lead area, pressing from the two opposite sides of each lead area toward the two slug holes, such that each lead area is disengaged from the metal substrate, whereby obtaining the multiple LED lead frame.
"In certain manufacturing methods, the insulating casing is made of a thermoplastic material or a thermoset material.
"In some manufacturing methods, the insulating casing is formed on each lead area by injection molding.
"In other manufacturing methods, two slug holes are formed on the first pair of two opposite sides of each lead area, and two openings are formed on the second pair of two opposite sides of each lead area, wherein in each lead area, the first pair of two opposite sides is longer than the second pair of the two opposite sides.
"In some manufacturing methods, each of the slug holes has an elongated bar shape, in which the length of the elongated bar is greater than or equal to the length of the first pair of two opposite sides of each lead area.
"According to another embodiment of the present disclosure, an LED lead frame structure comprises a metal substrate and multiple insulating casings. The metal substrate has multiple lead areas, wherein two slug holes are disposed on two opposite sides of each lead area. The multiple insulating casings are disposed on each of the multiple lead areas.
"In certain LED lead frame structures, the insulating casing is made of a thermoplastic material or a thermoset material.
"In some LED lead frame structures, the insulating casing is disposed on each lead area by injection molding.
"In other LED lead frame structures, two slug holes are disposed on the first pair of two opposite sides of each lead area, and two openings are formed on the second pair of two opposite sides of each lead area, wherein in each lead area, the first pair of two opposite sides is longer than the second pair of the two opposite sides.
"In some LED lead frame structures, each of the slug holes has an elongated bar shape, in which the length of the elongated bar is greater than or equal to the length of the first pair of two opposite sides of each lead area.
"In view of the foregoing, the technical solution provided by the present disclosure has significant benefits and advantages over the conventional technology. Substantial technical advancement is achieved by the above-mentioned technical solution, and a variety of applications in the industry are attained. Specifically, the present technical solution has, at least, the following advantages:
"1. During the stamping of the lead areas, the material is pressed from the two opposite sides of the lead areas toward the slug holes by the side, which prevents the insulating casing from cracking, and facilitate the natural disengagement of each lead area from the metal substrate, thereby obtaining multiple products (i.e., the LED lead frame); and
"2. Improves the yield rate and production capacity.
"Many of the attendant features and advantages of the present disclosure will becomes better understood with reference to the following detailed description considered in connection with the accompanying drawing.
BRIEF DESCRIPTION OF THE DRAWINGS
"So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings. It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
"The present description will be better understood from the following detailed description read in light of the accompanying drawing, wherein:
"FIG. 1 is a schematic drawing illustrating the crack of the insulating casing of the of a conventional LED lead frame;
"FIG. 2 is a flow chart illustrating the method for manufacturing LED lead frames according to one embodiment of the present disclosure;
"FIG. 3 is a schematic plane view of an LED lead frame structure according to one embodiment of the present disclosure, before the material release; and
"FIG. 4 is a schematic plane view of an LED lead frame structure according to another embodiment of the present disclosure, after the material release."
For additional information on this patent application, see: CHI, Chih-Lin. Led Lead Frame Structure and Method of Manufacturing Led Lead Frame. Filed
Keywords for this news article include: Semiconductor, Light-emitting Diode,
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