No assignee for this patent application has been made.
News editors obtained the following quote from the background information supplied by the inventors: "Personal computers and other electronic devices exhaust unwanted heat as hot air into offices and homes. This unwanted heat raises the temperature of the office or home and can require any HVAC system to work harder to maintain a comfortable temperature.
"In a personal computer, the majority of unwanted heat is generated by just a few components. Today a mid-range consumer CPU can generate just over 70W of heat and a top-end CPU can generate nearly double this, additional components such as graphics cards and compute cards can also generate significant unwanted heat, with a high-end graphics card generating up to 300W of unwanted heat alone.
"The majority of computers remove this unwanted heat from inside the enclosure by means of heatsinks and fans which exhaust unwanted heat into the surrounding air. Alternative cooling means such as direct liquid cooling which are found in some computer systems typically use a radiator and fan within the computer to exhaust unwanted heat into the surrounding air."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "By managing the unwanted heat generated by personal computers and other equipment, cooling costs of offices and homes can be reduced and energy efficiency improved. Described are methods and apparatus which can be used to accomplish this goal.
"These methods and apparatus can be used to reduce the amount of unwanted heat exhausted as hot air by apparatus without requiring that apparatus are installed into a larger enclosure to facilitate cooling. Amongst the potential benefits of the described apparatus is that unwanted heat can be removed in a form which can then be transported to either be dissipated or used to do useful work, for example heating hot water or other rooms.
"One apparatus described uses a heat transmitting means in the form of a heatpipe to communicate heat from a heat-generating component within an electronics apparatus to a thermally conductive surface, the thermally conductive surface disposed such that is can be contacted by a counterpart surface belonging to an external apparatus. External apparatus can then be contacted to the thermally conductive surface to enable thermal communication between heat-generating components of the apparatus and the external apparatus.
"Another described apparatus provides a counterpart surface suitable to be contacted to equipment having a thermally conductive surface, the apparatus enabling the removal of unwanted heat to a liquid medium which can then be transported for dissipation or to be used in a useful manner.
"The apparatus is then described in use in the context of an office environment, unwanted heat from a plurality of computer systems is removed by liquid cooling apparatus and transported to be dissipated by a radiator or similar cooling means.
"Amongst the advantages of the described apparatus is the ability to remove unwanted heat generated by apparatus efficiently whilst enjoying the freedom to cool apparatus using any cooling technology, the only requirement being that cooling apparatus can be configured to be contacted to and remove heat from a thermally conductive surface on the apparatus. This allows for the use of cooling which is better suited to the kind of environment the apparatus is operating in.
"These and other features, aspects, and advantages of the present invention will become better understood with regard to the following description, appended claims, and accompanying drawings where:
"FIG. 1 shows a computer system comprising a thermally conductive surface which is contactable by cooling apparatus;
"FIG. 2 shows a rear view of the computer system of FIG. 1;
"FIG. 3 shows an exploded view of a liquid cooled apparatus in contact with a thermally conductive surface similar to that of the computer system in FIG. 1, and;
"FIG. 4 is a diagram of a cooling loop comprising a radiator and a plurality of computer systems."
For additional information on this patent application, see: Davidson,
Keywords for this news article include: Patents.
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