News Column

Researchers Submit Patent Application, "Circuit Board System", for Approval

February 12, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor Wille, Markus (Boenen, DE), filed on August 30, 2012, was made available online on January 30, 2014.

No assignee for this patent application has been made.

News editors obtained the following quote from the background information supplied by the inventors: "Currently, a circuit board regularly consists of a number of rigid layers of fibreglass-reinforced cured epoxy resin plates which are copper clad on one or both sides or provided with conductor tracks. The circuit board is equipped with semiconductor components, with connecting elements, with elements for heat dissipation or the like.

"In the sense of a modular structure, it has become known to provide a circuit board system with a plane carrier circuit board in which at least one circuit board module is arranged (DE 10 2004 019 431 A1). In this context, the at least one circuit board module aligned in parallel with the carrier plate is arranged in a recess in the carrier circuit board.

"The problem in the above circuit board system is always that of fixing the circuit board module in the associated recess. Known measures for fixing are in this case bonding, soldering or the like. These measures are expensive to implement."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "The invention is based on the problem of designing and developing the known circuit board system in such a manner that fixing the circuit board module in the recess associated with the circuit board module is simplified.

"The above problem is solved in a circuit board system that includes a carrier circuit board which is essentially planar at least in sections, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board is arranged with at least one rigid layer copper clad on one or both sides or provided with conductor tracks, in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.

"One factor is the consideration that the mechanical stability of carrier circuit board and circuit board module is regularly sufficient for implementing a press fit for the circuit board module.

"Correspondingly, it is proposed that the circuit board module is pressed into the recess in the carrier circuit board associated with the circuit board module and that the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.

"Another factor is that the arrangement is constructed in such a manner that pressing the circuit board module in with a pressing force which is essentially aligned perpendicularly to the flat side of the circuit board module is possible.

"In one embodiment, the friction lock is essentially aligned in parallel with the plane of the carrier circuit board.

"With a suitable design, the press fit of the circuit board module is adequate for fixing it in the carrier circuit board. Fixing the circuit board module cannot be implemented with less expenditure.

"In one embodiment, the press fit holds the circuit board module in the recess in the carrier circuit board. In one embodiment, the circuit board module engages with the associated recess in a friction-locked manner at least in sections, preferably completely. In another embodiment, the circuit board module and the carrier circuit board are arranged essentially in one plane, preferably that the circuit board module and the carrier circuit board end flush, particularly on both sides. In one embodiment, the cross-sectional profile of the edge of the circuit board module and the cross-sectional profile of the edge of the associated recess are matched to one another to form a positive lock. In one embodiment, the cross-sectional profile of the edge of the circuit board module and/or the cross-sectional profile of the edge of the associated recess forms or form at least one peripheral web and/or at least one peripheral groove. In one embodiment, the outer contour of the edge of the circuit board module and the inner contour of the edge of the associated recess are matched to one another to form a positive lock. In one embodiment, the outer contour of the edge of the circuit board module and/or the inner contour of the edge of the associated recess has or have a periodically repetitive structure, particularly a toothed, serrated or waved structure. In one embodiment, the edge of the circuit board module and/or the edge of the recess is or are at least partially metalized. In one embodiment, the circuit board module is designed differently from the carrier circuit board with regard to the material composition and/or surface property and/or layer structure and/or number of layers and/or board thickness. In one embodiment, the carrier circuit board and/or the circuit board module is or are designed as rigid/flexible circuit board. In one embodiment, a flexible section of the circuit board module extends over the edge of the associated recess in the carrier circuit board. In one embodiment, an electrical contact-connection between the carrier circuit board and the circuit board module is provided, preferably that the electrical contact-connection is established by inserting the circuit board module into the associated recess.

"In one embodiment, the carrier circuit board has at least one elastic area in the area of the recess, the elastic restoring force of which acts on the circuit board module, preferably in that the at least one elastic area, for increasing the elastic resilience, has at least one weakening of material, especially at least one recess or at least one through-contact arrangement in the carrier circuit board.

"According to the invention, the circuit board module can be designed to be different from the circuit board carrier in any regard. This makes it possible to achieve considerable cost savings in the production of the circuit board system, for example in that costly materials are used only where they are absolutely necessary.

"In one embodiment, the circuit board module can be removed from the recess and subsequently inserted again. This can simplify any possible maintenance work. In a more specific embodiment, the circuit board module can be removed from the recess by applying a disengaging force and subsequently pressed into the recess again by forming the press fit.

"Another embodiment provides a method for the assembly of a circuit board system. In particular, the invention provides a method for the assembly of a circuit board system comprising an at least sectionally essentially planar carrier circuit board, wherein the carrier circuit board has at least one rigid layer copper clad on one or both sides or provided with conductor tracks, wherein at least one essentially planar circuit board module aligned in parallel with the carrier circuit board having at least one rigid layer copper clad on one or both sides or provided with conductor tracks is arranged in an associated recess in the carrier circuit board. In particular, the circuit board module is pressed into the recess in the carrier circuit board and, during this process, the edge of the circuit board module is engaged with the edge of the associated recess in a friction-locked manner to form a press fit.

"In one embodiment, the circuit board module is pressed into the recess in the carrier circuit board and that, in this process, the edge of the circuit board module is engaged in a friction-locked manner with the edge of the associated recess to form a press fit.

"In the method of the invention, the fact is particularly advantageous that the method step of inserting the circuit board module into the recess in the carrier circuit board can be implemented in a particularly simple manner.

"In one embodiment, the circuit board module is clipped into the recess of the carrier circuit board so that the pressing-in force during the insertion of the circuit board module passes through a steep maximum. In this context, the fact is advantageous, among other things, that a predefined and reproducible pressing-in depth is maintained by the clipping-in.

BRIEF DESCRIPTION OF THE FIGURES

"In the text which follows, the invention will be explained in greater detail by means of a drawing only showing illustrative embodiments. In the drawings:

"FIG. 1 shows a circuit board system according to the invention a) with a disassembled circuit board module and b) with an assembled circuit board module, in each case in a perspective representation.

"FIG. 2 shows, a) a further circuit board system according to the proposal with disassembled circuit board module in a perspective view, b) a further circuit board system according to the proposal with disassembled circuit board module in a sectional view, c) a further circuit board system according to the proposal with disassembled circuit board module in a sectional view.

"FIG. 3 shows a further circuit board system according to the proposal with disassembled circuit board module in a perspective representation."

For additional information on this patent application, see: Wille, Markus. Circuit Board System. Filed August 30, 2012 and posted January 30, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=3525&p=71&f=G&l=50&d=PG01&S1=20140123.PD.&OS=PD/20140123&RS=PD/20140123

Keywords for this news article include: Patents, Electronics, Circuit Board.

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Source: Electronics Newsweekly


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