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Patent Application Titled "Multi-Layered Ceramic Electronic Component and Method of Manufacturing the Same" Published Online

February 14, 2014



By a News Reporter-Staff News Editor at Health & Medicine Week -- According to news reporting originating from Washington, D.C., by NewsRx journalists, a patent application by the inventors Kwag, Joon Hwan (Suwon, KR); Kim, Sang Huk (Suwon, KR), filed on September 14, 2012, was made available online on January 30, 2014 (see also Patents).

No assignee for this patent application has been made.

Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a high capacitance multi-layered ceramic electronic component capable of suppressing infiltration of a plating solution into an internal electrode to have excellent reliability, even in the case in which an external electrode is relatively thin.

"In accordance with the recent trend for the miniaturization of electronic products, demand for a small multi-layered ceramic electronic component having high capacitance has increased.

"Therefore, a dielectric layer and an internal electrode have been thinned and multilayered through various methods. Recently, as a thickness of the dielectric layer has been reduced, a multilayered ceramic electronic component having an increased number of layers has been manufactured.

"In addition, as an external electrode also has been required to be thin, a plating solution may infiltrate into an inner portion of a chip through the thinned external electrode, and thus there may be present a technical difficulty in the miniaturization process.

"Particularly, in the case in which the external electrode has a non-uniform shape, a risk that the plating solution may infiltrate through a relatively thin portion thereof is further increased, such that product reliability may not be secured.

"Therefore, in the case in which a high capacitance product is small, it is important to secure product reliability.

"The following Related Art Document discloses features of the case in which a resistor film including a curable resin is formed on an end portion of a ceramic body, but infiltration of the plating solution through an external electrode may not be solved."

In addition to obtaining background information on this patent application, NewsRx editors also obtained the inventors' summary information for this patent application: "An aspect of the present invention provides a high capacitance multilayered ceramic electronic component capable of suppressing infiltration of a plating solution into an internal electrode to have excellent reliability, even in the case in which an external electrode is relatively thinned.

"According to an aspect of the present invention, there is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces opposing each other in a stacking direction of the dielectric layer, third and fourth end surfaces connecting the first and second main surfaces to each other and opposing each other in a length direction, and fifth and sixth side surfaces connecting the first and second main surfaces to each other and opposing each other in a width direction; internal electrodes disposed to face each other in the ceramic body and having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein in the length-thickness cross-section of the ceramic body, the external electrodes include first external electrodes formed from the third or fourth end surface to the first and second main surfaces, and second external electrodes formed from the third or fourth end surfaces to the first and second main surfaces on the first external electrodes, having a length shorter than a length to which the first external electrodes are formed on the first and second main surfaces, and containing an epoxy resin.

"The first external electrode formed on the third or fourth end surface may have an average thickness of 10 .mu.m or less.

"The first external electrode formed on the first and second main surfaces may have an average thickness of 2 to 10 .mu.m.

"The second external electrode may have an average thickness of 5 to 15 .mu.m.

"The first external electrode may contain a conductive metal having a content of 60 wt % or less based on the total weight thereof, and the conductive metal may be at least one selected from a group consisting of copper (Cu), nickel (Ni), silver (Ag), and sliver-palladium (Ag--Pd).

"In the length direction of the ceramic body, when a total length of the external electrode is L and a length of the second external electrode is E, 0.05.ltoreq.E/L.ltoreq.0.3 may be satisfied.

"The multilayered ceramic electronic component may further include a plating layer formed on the external electrode.

"According to another aspect of the present invention, there is provided a multilayered ceramic electronic component including: a ceramic body including a dielectric layer and having first and second main surfaces opposing each other in a stacking direction of the dielectric layer, third and fourth end surfaces connecting the first and second main surfaces to each other and opposing each other in a length direction, and fifth and sixth side surfaces connecting the first and second main surfaces to each other and opposing each other in a width direction; internal electrodes disposed to face each other in the ceramic body and having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein in the length-thickness cross-section of the ceramic body, the external electrodes include first external electrodes formed from the third or fourth end surface to the first and second main surfaces, and second external electrodes formed on the first external electrodes and containing an epoxy resin, and when a total length of the external electrode is L and a length of the second external electrode is E, 0.05.ltoreq.E/L.ltoreq.0.3 may be satisfied.

"The first external electrode formed on the third or fourth end surface may have an average thickness of 10 .mu.m or less.

"The first external electrode formed on the first and second main surfaces may have an average thickness of 2 to 10 .mu.m.

"The second external electrode may have an average thickness of 5 to 15 .mu.m.

"The first external electrode may contain a conductive metal having a content of 60 wt % or less based on the total weight thereof.

"According to another aspect of the present invention, there is provided a method of manufacturing a multilayered ceramic electronic component including: preparing a ceramic body including dielectric layers and a plurality of internal electrodes disposed to face each other and having the dielectric layer interposed therebetween; preparing a conductive paste for an external electrode containing a conductive metal; applying the conductive paste for an external electrode to an end portion of the ceramic body to be electrically connected to the internal electrodes to thereby form first external electrodes; forming second external electrodes containing an epoxy resin on the first external electrodes; and firing the ceramic body to form the external electrodes, wherein in a length direction of the ceramic body, when a total length of the external electrode is L and a length of the second external electrode is E, 0.05.ltoreq.E/L.ltoreq.0.3 may be satisfied.

"The first external electrode formed on the third or fourth end surface may have an average thickness of 10 .mu.m or less.

"The first external electrode formed on the first and second main surfaces may have an average thickness of 2 to 10 .mu.m.

"The second external electrode may have an average thickness of 5 to 15 .mu.m.

"The second external electrode may be formed by a dipping method.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a perspective view schematically illustrating a multilayered ceramic capacitor according to an embodiment of the present invention;

"FIG. 2 is a cross-sectional view taken along line B-B' of FIG. 1;

"FIG. 3 is an enlarged view of part A of FIG. 2; and

"FIG. 4 is a view illustrating a manufacturing process of the multilayered ceramic capacitor according to the embodiment of the present invention."

For more information, see this patent application: Kwag, Joon Hwan; Kim, Sang Huk. Multi-Layered Ceramic Electronic Component and Method of Manufacturing the Same. Filed September 14, 2012 and posted January 30, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=3588&p=72&f=G&l=50&d=PG01&S1=20140123.PD.&OS=PD/20140123&RS=PD/20140123

Keywords for this news article include: Patents.

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Source: Health & Medicine Week


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