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"Multilayered Ceramic Electronic Component and Manufacturing Method of the Same" in Patent Application Approval Process

February 12, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- A patent application by the inventors KIM, Sung Woo (Suwon-si, KR); CHOI, Jae Yeol (Suwon-si, KR); KIM, Yu Na (Suwon-si, KR); LEE, Jong Ho (Suwon-si, KR), filed on November 26, 2012, was made available online on January 30, 2014, according to news reporting originating from Washington, D.C., by VerticalNews correspondents.

This patent application is assigned to Samsung Electro-mechanics Co., Ltd.

The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a multilayered ceramic electronic component and a manufacturing method of the same.

"As examples of electronic components using a ceramic material there may be provided a capacitor, an inductor, a piezoelectric element, a varistor, a thermistor, and the like.

"Among these ceramic electronic components, a multilayered ceramic capacitor (MLCC) has a small size and high capacity, and is easily mounted.

"The multilayered ceramic capacitor, a condenser having a chip shape, may be installed in circuit boards of various electronic products including a display device such as a liquid crystal display (LCD), a plasma display panel (PDP), or the like, a computer, a personal digital assistant (PDA), a cellular phone, and the like, to be charged with or discharge electricity.

"Due to the recent trend for display devices to have a large size, a central processing unit (CPU) of the computer to be increased in speed, and the like, heat generation by an electronic device is intensified.

"Therefore, it is necessary for stable capacitance at a high temperature and reliability to be secured in a multilayered ceramic capacitor so that an integrated circuit IC installed in the electronic device may be stably operated.

"Since the multilayered ceramic capacitor is multilayered after an internal electrode having a predetermined thickness and an area smaller than that of the ceramic sheet is printed on the ceramic sheet, a step between a margin portion and a dielectric layer having the internal electrode formed thereon may be generated.

"Accordingly, in a manufacturing process, while a plurality of ceramic sheets each having the internal electrode printed thereon are stacked and then pressed with uniform pressure, the margin portion having the step has a limitation in contraction, such that delaminations or cracks in which portions of multilayered dielectric layers are separated from each other may be generated due to the step.

"Therefore, moisture, ions, a conductive foreign material, or the like, may be permeated into a surface of the multilayered ceramic capacitor where the internal electrode is exposed through the delaminations or cracks, resulting in insulation resistance deterioration in the multilayered ceramic electronic component, a degradation of reliability, and the like. In particular, the problems may be intensified in super capacitor products having a relatively large number of multilayered layers.

"Related art document 1 discloses a multilayered ceramic capacitor, wherein outer layer ceramic green sheets are formed on an upper surface and a lower surface of a ceramic green sheet multilayered body having internal electrodes formed therein. However, it does not disclose that a viscosity of a material configuring the outer layer ceramic green sheets is higher than that of a material configuring a ceramic multilayered body."

In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventors' summary information for this patent application: "An aspect of the present invention provides a multilayered ceramic electronic component capable of compensating for a step in a ceramic body thereof to suppress a delamination or crack generation, such that penetration of moisture, ions, a conductive foreign material, or the like, into surfaces from which internal electrodes are exposed is significantly reduced.

"According to an aspect of the present invention, there is provided a multilayered ceramic electronic component including: a ceramic body in which a plurality of dielectric layers are stacked; a plurality of first and second internal electrodes formed on at least one of the dielectric layers and alternately exposed through both ends of the ceramic body in a stacking direction of the ceramic body; and a step compensation cover including a ceramic material having a viscosity higher than that of a ceramic material included in the ceramic body and formed on at least one of an upper surface and a lower surface of the ceramic body.

"The ceramic material included in the step compensation cover may have a viscosity of 10,000 to 1,000,000 cps.

"The step compensation cover may be formed on a margin portion which is recessed in the ceramic body.

"The step compensation cover may completely cover at least one of the upper surface and the lower surface of the ceramic body.

"The multilayered ceramic electronic component may further include first and second external electrodes formed on both ends of the ceramic body and electrically connected to exposed portions of the first and second internal electrodes.

"According to another aspect of the present invention, there is provided a manufacturing method of a multilayered ceramic electronic component, the method including: preparing a plurality of ceramic green sheets using a first ceramic slurry; forming first and second internal electrode patterns on at least one surface of each of the plurality of ceramic green sheets so as to be alternately exposed through both end surfaces thereof;

"forming a laminate by stacking the plurality of ceramic green sheets having the first and second internal electrode patterns formed thereon; forming a step compensation cover on at least one of an upper surface and a lower surface of the laminate, using a second ceramic slurry having a viscosity higher than that of a first ceramic slurry; cutting the laminate having the step compensation cover formed thereon into individual chips; and forming a ceramic body by firing the cut individual chips.

"In the forming of the step compensation cover, the second ceramic slurry may have a viscosity of 10,000 to 1,000,000 cps.

"In the forming of the step compensation cover, the step compensation cover may be formed by applying the second ceramic slurry having a viscosity of 10,000 to 300,000 cps to at least one of the upper surface and the lower surface of the multilayered body.

"In the forming of the step compensation cover, the step compensation cover may be formed by preparing a ceramic cover sheet using the second ceramic slurry having a viscosity of 300,001 to 1,000,000 cps, and high-temperature and high-pressure pressing the ceramic cover sheet on at least one of the upper surface and the lower surface of the laminate.

"In the forming of the step compensation cover, the step compensation cover may be formed on a margin portion which is recessed in the ceramic body.

"In the forming of the step compensation cover, the step compensation cover may completely cover at least one of the upper surface and the lower surface of the ceramic body.

"The manufacturing method may further include forming first and second external electrodes on the both end surfaces of the ceramic body so as to cover s so as to cover exposed surfaces of the first and second internal electrode patterns.

BRIEF DESCRIPTION OF THE DRAWINGS

"The above and other aspects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

"FIG. 1 is a perspective view illustrating a schematic structure of a multilayered ceramic capacitor according to an embodiment of the present invention;

"FIG. 2 is a perspective view schematically illustrating a ceramic body of FIG. 1, without external electrodes;

"FIG. 3 is a cross-sectional view taken along line A-A' of FIG. 2;

"FIG. 4 is a side view of FIG. 2;

"FIG. 5 is a side view illustrating a state in which a plurality of ceramic bodies are connected to each other in a vertical direction before being cutting into individual ceramic bodies as illustrated in FIG. 2;

"FIG. 6 is a perspective view illustrating a ceramic body, a first internal electrode, and a step compensation cover of a multilayered ceramic capacitor of another embodiment of the present invention; and

"FIG. 7 is a cross-sectional view taken along line B-B' of FIG. 6."

URL and more information on this patent application, see: KIM, Sung Woo; CHOI, Jae Yeol; KIM, Yu Na; LEE, Jong Ho. Multilayered Ceramic Electronic Component and Manufacturing Method of the Same. Filed November 26, 2012 and posted January 30, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=3587&p=72&f=G&l=50&d=PG01&S1=20140123.PD.&OS=PD/20140123&RS=PD/20140123

Keywords for this news article include: Electronic Components, Samsung Electro-mechanics Co. Ltd.

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Source: Electronics Newsweekly


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