This patent application is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "An electronic apparatus is a device including a circuit substrate having signal lines and a plurality of semiconductor packages mounted on the circuit substrate. Signals propagating through the signal lines formed in the circuit substrate are input into and output from the semiconductor packages.
"The circuit substrate is a board including glass cloth and a thermosetting resin impregnated into the glass cloth. The permittivity of glass cloth is not constant, and varies in the circuit substrate. Accordingly, when a signal propagates through a signal line, the permittivity is changed depending on the position of the signal line in the circuit substrate.
"An electronic apparatus in which variations in the signal propagation time are reduced by providing signal lines in a polyimide film and by allowing signals to be transmitted through the signal lines has been proposed.
"A polyimide film is a flexible insulating film. A polyimide film in which signal lines are provided (hereinafter referred to as a 'flexible circuit substrate') is disposed between a semiconductor package and a circuit substrate.
"An example of the above-described related art is disclosed in Japanese Laid-open Patent Publication No. 2011-103441.
"In the above-described electronic apparatus, through-holes are formed in the flexible circuit substrate, and electrodes of a semiconductor package and electrodes of a circuit substrate (for example, a printed wiring board) are connected to each other via bumps which pass through the through-holes. Then, by using these bumps, the flexible circuit substrate is fixed to the circuit substrate.
"However, before the flexible circuit substrate is fixed by using the bumps, it is likely that the flexible circuit substrate will be tilted or displaced if a slight force is applied or the flexible circuit substrate is thermally expanded during a reflowing process.
"If the flexible circuit substrate is tilted, a connection fault may occur in bumps which connect the flexible circuit substrate and the semiconductor packages. If the flexible circuit substrate is displaced, a connection fault may occur in bumps which connect the flexible circuit substrate and the circuit substrate."
In addition to the background information obtained for this patent application, VerticalNews journalists also obtained the inventors' summary information for this patent application: "According to an aspect of the invention, An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.
"The object and advantages of the invention will be realized and attained by means of the elements and combinations particularly pointed out in the claims.
"It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are not restrictive of the invention, as claimed.
BRIEF DESCRIPTION OF DRAWINGS
"FIG. 1 is a plan view illustrating an example of an electric circuit apparatus of an embodiment;
"FIG. 2 is an enlarged view illustrating a region surrounded by the broken lines in FIG. 1;
"FIG. 3 is a sectional view taken along line of FIG. 2;
"FIG. 4 is an exploded view illustrating a section taken along line IV-IV of FIG. 2;
"FIG. 5 is a partial plan view illustrating a first circuit board taken along line V-V of FIG. 4;
"FIG. 6 is a partial plan view illustrating a second circuit board taken along line VI-VI of FIG. 4;
"FIG. 7 is a partial sectional view illustrating the first circuit board;
"FIG. 8 is a sectional view illustrating an electric circuit apparatus which does not include a support body or projections;
"FIG. 9 is a sectional view illustrating a problem of the electric circuit apparatus illustrated in FIG. 8;
"FIG. 10 is a sectional view illustrating a problem of the electric circuit apparatus illustrated in FIG. 8;
"FIG. 11 illustrates another example of an electric circuit apparatus of this embodiment;
"FIG. 12 is a sectional view illustrating components forming an electric circuit apparatus;
"FIG. 13 is a sectional view illustrating a step of a manufacturing method for an electric circuit apparatus; and
"FIG. 14 is a sectional view illustrating a step of a manufacturing method for an electric circuit apparatus."
URL and more information on this patent application, see: Kurashina, Mamoru;
Keywords for this news article include: Electronics, Circuit Board, Semiconductor,
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