Tessera Technologies announced that Tessera's subsidiary, Tessera has entered into an agreement with Advanced Semiconductor Engineering and ASE (U.S.) (collectively, "ASE") to settle all claims at issue between ASE and Tessera in the case styled Tessera, Inc: v. Advanced Micro Devices et al. (Case No. 4:05-CV-04063 (United States District Court for the Northern District of California)).
According to a release, under the terms of the agreement ASE agrees to pay Tessera, Inc. a total of $30M U.S. Dollars, comprised of a one-time payment in the first quarter of 2015 and annual recurring payments commencing in the first quarter of 2015 through the first quarter of 2018.
"We are very pleased to have reached a settlement with ASE," said Tom Lacey, CEO of Tessera. "Having resolved this dispute, we look forward to collaborating with ASE in the future. With our companies' mutual technology capabilities and innovations there is much we can do together to produce value for the industry."
"ASE is also pleased to have resolved our dispute with Tessera," said Dr. Tien Wu, ASE's Chief Operating Officer. "Both ASE and Tessera share the view that technology engagement is in the best interests of our customers and shareholders. ASE is a world leader in semiconductor packaging and collaboration between our companies presents interesting market opportunities."
Tessera Technologies is a holding company.
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