News Column

Researchers Submit Patent Application, "Printed Circuit Board Structure", for Approval

March 5, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Wang, Steven (Songjiang EPZ Shanghai, CN); Wu, Jin-Chang (New Taipei City, TW); Yang, Mide (Songjiang EPZ Shanghai, CN), filed on January 15, 2013, was made available online on February 20, 2014.

The patent's assignee is Tech-front (shanghai) Computer Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to a printed circuit board.

"A printed circuit board is normally made of epoxy resin with strengthened glass fibers embedded therein. However, with the miniaturization of the integrated circuit in electric industries, the epoxy resin of the printed circuit board is becoming deficient to provide expected performance in electricity conduction when high-speed elements thereon operate in high temperature. Thus, for the epoxy resin of the printed circuit board, more attentions have to be paid to its thermal expansion coefficient and heat resistance, and to bonding of the soldering pad of the printed circuit board to the epoxy resin. For instance, if the bonding strength between the epoxy resin and the soldering pad of the printed circuit board is not enough, cracks may occur on the printed circuit board to separate the soldering pad from the printed circuit board.

"Given the above, the conventional printed circuit board still has the inconvenience and shortages and requires improvements. As such, there are still needs to effectively solve the inconvenience and shortages."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "One aspect of the present disclosure provides a printed circuit board structure with appropriate thermal expansion coefficient and the heat resistance, for increasing the bonding strength of the epoxy resin and the soldering pad of the printed circuit board.

"A printed circuit board structure provided according to one embodiment of the disclosure comprises a plurality of circuit layer plates stacked together. Each of the circuit layer plates comprises an epoxy resin plate body and a fiber fabric completely encapsulated inside the epoxy resin plate body. Each of the circuit layer plates which is stacked between two of the circuit layer plates is further provided with filler particles distributed in the epoxy resin plate body of the circuit layer plate. Also, In all of the circuit layer plates, the two opposite and outermost circuit layer plates thereof are provided with metal soldering pads on outer surfaces of the epoxy resin plate bodies of the two opposite and outermost circuit layer plates, respectively, and both the two opposite and outermost circuit layer plates thereof have no filler particle in the epoxy resin plate body thereof.

"A printed circuit board structure provided according to another embodiment of the disclosure comprises two opposite and outermost circuit layer plates and a middle layer. Each of the two opposite and outermost circuit layer plates comprises a first epoxy resin plate body, a metal soldering pad bonded on an outer surface of the first epoxy resin plate body, and a first fiber fabric completely encapsulated inside the first epoxy resin plate body. The middle layer comprises at least one circuit layer plate stacked between the two opposite and outermost circuit layer plates, and the circuit layer plate comprises a second epoxy resin plate body, a second fiber fabric completely encapsulated inside the second epoxy resin plate body, and filler particles distributed in the second epoxy resin plate body. Among the two opposite and outermost circuit layer plates and the at least one circuit layer plate of the middle layer, only the second epoxy resin plate body of the at least one circuit layer plate of the middle layer has the filler particles therein.

"A printed circuit board structure provided according to the other embodiment of the disclosure comprises two opposite and outermost circuit layer plates, and at least one middle circuit layer plate stacked between the two opposite and outermost circuit layer plates. Each of the two opposite and outermost circuit layer plates comprising a first epoxy resin plate body, a metal soldering pad bonded on an outer surface of the first epoxy resin plate body, a first fiber fabric completely encapsulated inside the first epoxy resin plate body, and a plurality of first filler particles distributed in the first epoxy resin plate body with a first weight percentage being greater than zero. The middle circuit layer plate comprises a second epoxy resin plate body, a second fiber fabric completely encapsulated inside the second epoxy resin plate body, and a plurality of second filler particles distributed in the second epoxy resin plate body with a second weight percentage greater than the first weight percentage.

"To sum, by organizing the quantity of the filler particles in the epoxy resin plate bodies of both the middle circuit layer plate and the two opposite and outermost circuit layer plates, the printed circuit board structure of the disclosure not only provides appropriate thermal expansion coefficient and the heat resistance thereof, but also enhances the bonding strength of the epoxy resin and the soldering pad of the printed circuit board, so as to increase product life and operation performance of the printed circuit board structure.

BRIEF DESCRIPTION OF THE DRAWINGS

"The present disclosure will be apparent to those skilled in the art by reading the following detailed description of a preferred embodiment thereof, with reference to the attached drawings, in which:

"FIG. 1 is a part sectional view illustrating a printed circuit board structure according to a first embodiment of the present disclosure;

"FIG. 2 is a part sectional view illustrating a printed circuit board structure according to a second embodiment of the present disclosure; and

"FIG. 3 is a comparison chart for the bonding strength of the soldering pad bonding on the epoxy resin plate body having 15% weight percentage of the filler particles and the bonding strength of the soldering pad bonding on the epoxy resin plate body having none of filler particles, according to the embodiment of the printed circuit board structure of the present disclosure."

For additional information on this patent application, see: Wang, Steven; Wu, Jin-Chang; Yang, Mide. Printed Circuit Board Structure. Filed January 15, 2013 and posted February 20, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5709&p=115&f=G&l=50&d=PG01&S1=20140213.PD.&OS=PD/20140213&RS=PD/20140213

Keywords for this news article include: Electronics, Circuit Board, Tech-front (shanghai) Computer Co. Ltd.

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Source: Electronics Newsweekly


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