News Column

Micron Technology Assigned Patent for Semiconductor Dice

February 3, 2014

By Targeted News Service

ALEXANDRIA, Va., Feb. 3 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,637,962) developed by Salman Akram, Boise, Idaho, and Sidney B. Rigg, Meridian, Idaho, for a "semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate."

The patent application was filed on Sept. 14, 2012 (13/620,065). The full-text of the patent can be found at

Written by Balkishan Dalai; edited by Jaya Anand.


For more stories covering the world of technology, please see HispanicBusiness' Tech Channel

Source: Targeted News Service

Story Tools