News Column

Micron Technology Assigned Patent for Semiconductor Dice

February 3, 2014



By Targeted News Service

ALEXANDRIA, Va., Feb. 3 -- Micron Technology, Boise, Idaho, has been assigned a patent (8,637,962) developed by Salman Akram, Boise, Idaho, and Sidney B. Rigg, Meridian, Idaho, for a "semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate."

The patent application was filed on Sept. 14, 2012 (13/620,065). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=14&f=G&l=50&co1=AND&d=PTXT&s1=20140128.PD.&s2=%28ID.ASST.%29&OS=ISD/01/28/2014+AND+AS/ID&RS=ISD/01/28/2014+AND+AS/ID

Written by Balkishan Dalai; edited by Jaya Anand.

BD0203JA0203-974526


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Source: Targeted News Service


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