News Column

Researchers Submit Patent Application, "Light-Emitting Device Manufacturing Method", for Approval

February 26, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Marutani, Yukitoshi (Anan-shi, JP); Miyata, Tadaaki (Yokohama-shi, JP), filed on July 30, 2013, was made available online on February 13, 2014.

The patent's assignee is Nichia Corporation.

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates to a method of manufacturing a light-emitting device using a light-emitting diode.

"Recently, light-emitting devices using a light-emitting diode such as LED lighting or television backlights using an LED are becoming widely popular.

"However, since light-emitting devices using a light-emitting diode are still very expensive compared to conventional light-emitting devices such as an incandescent bulb or a fluorescent lamp, a further reduction in prices must be achieved in order to promote popularization of such light-emitting devices."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "In one embodiment, a method for manufacturing a light-emitting device comprises retaining a conductor wire so that a straight-line distance between adjacent mounting portions while the conductor is retained is less than a distance along the conductor wire between the adjacent mounting portions; mounting a plurality of light emitting diodes to respective ones of the mounting portions on the retained conductor wire; and after the mounting step, sealing the plurality of light-emitting diodes mounted on the conductor wire.

"In one aspect, the conductor wire is intersected with a plurality of rod members to set the straight-line distance between the adjacent mounting portions.

"In one aspect, the conductor wire is intersected with a plurality of rod members and a plurality of protrusions which are alternately arranged to set the straight-line distance between the adjacent mounting portions.

"In one aspect, the conductor wire is wound around a rod member to set the straight-line distance between the adjacent mounting portions.

"In one aspect, the conductor wire is wound around a rod member and the rod member is subsequently cut along a longitudinal direction to set the straight-line distance between the adjacent mounting portions.

"In one aspect, the method further comprises releasing the retention of the conductor wire on which the plurality of light-emitting diodes are mounted, wherein a straight-line distance between the adjacent mounting portions after the retention is released is less than or equal to the distance along the conductor wire between the adjacent mounting portions and greater than the straight-line distance between adjacent mounting portions while the conductor is retained.

"In one aspect, the plurality of light-emitting diodes mounted on the conductor wire are sealed by a translucent sealing member.

"In one aspect, the plurality of light-emitting diodes are individually sealed by a phosphor-containing first sealing member, and the first sealing member is subsequently sealed by a second sealing member.

"In one aspect, the plurality of light-emitting diodes are individually sealed by a phosphor-containing first sealing member, and a plurality of first sealing members are subsequently collectively sealed by a second sealing member.

"In one aspect, the conductor wire is attached to a substrate, and the retention is performed while the conductor wire is attached to the substrate.

"In one aspect, the scaling step is performed before the releasing step.

"In one aspect, the sealing step is performed after the releasing step.

"In one aspect, the light emitting diodes are LED chips.

"According to embodiments of the present invention, a light-emitting device using a light-emitting diode can be manufactured more inexpensively than in the past.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIG. 1 is a flow chart for describing a light-emitting device manufacturing method according to one embodiment;

"FIG. 2 is a diagram showing an example of an LED chip, in which FIG. 2A is a plan view, and FIG. 2B is a sectional view showing a cross section taken along A-A in FIG. 2A;

"FIG. 3 is a diagram illustrating a first example of a sealing method, in which FIG. 3A is a top view. FIG. 3B is a side view, and FIG. 3C is a front view;

"FIG. 4 is a diagram illustrating a second example of a sealing method, in which FIG. 4A is a top view, FIG. 4B is a side view, and FIG. 4C is a front view;

"FIG. 5 is a diagram illustrating an example (Example 1) of a light-emitting device manufacturing method using a fabric-style bending method, in which FIG. 5A is an upper view of a plurality of rod members and the conductor wire intersecting with the rod members, FIG. 5B is a side view of the plurality of rod members and the conductor wire intersecting with the rod members, and FIG. 5C is an upper view of the conductor wire that has been extended;

"FIG. 6 is a diagram illustrating an example (Example 2) of a light-emitting device manufacturing method using a fabric-style bending method, in which FIG. 6A is an upper view of a plurality of rod members and the conductor wire intersecting with the rod members, FIG. 6B is a side view of the plurality of rod members and the conductor wire intersecting with the rod members, and FIG. 6C is an upper view of the conductor wire that has been extended;

"FIG. 7 is a diagram illustrating an example (Example 3) of a light-emitting device manufacturing method using a fabric-style bending method, in which FIG. 7A is an upper view of an insulative and flexible film with a slit (an example of an insulative and flexible member to which a conductor wire can be attached), FIG. 7B is an upper view of the conductor wire attached to the film with a slit, and FIG. 7C is an upper view of the conductor wire attached to the film with a slit and a plurality of rod members;

"FIG. 8 is a diagram illustrating an example (Example 1) of a light-emitting device manufacturing method using a rod-and-protrusion bending method, in which FIG. 8A is an upper view of a plurality of rod members and a plurality of protrusions and a conductor wire intersecting with the rod members and the protrusions, FIG. 8B is a side view of the plurality of rod members and a plurality of protrusions and a conductor wire intersecting with the rod members and the protrusions, and FIG. 8C is an upper view of the conductor wire that has been extended;

"FIG. 9 is a diagram illustrating an example (Example 2) of a light-emitting device manufacturing method using a rod-and-protrusion bending method, in which FIG. 9A is an upper view of a plurality of rod members and a plurality of protrusions and a conductor wire intersecting with the rod members and the protrusions, FIG. 9B is a side view of the plurality of rod members and a plurality of protrusions and a conductor wire intersecting with the rod members and the protrusions, and FIG. 9C is an upper view of the conductor wire that has been extended;

"FIG. 10 is a diagram illustrating an example (Example 3) of a light-emitting device manufacturing method using a rod-and-protrusion bending method, in which FIGS. 10A to 10C, 10E, and 10F are upper views, and FIG. 10D shows an upper view and a side view;

"FIG. 11 is a diagram illustrating an example (Example 4) of a light-emitting device manufacturing method using a rod-and-protrusion bending method, in which FIG. 11A is a diagram showing conductor wires and a substrate intersecting with a plurality of rod members and a plurality of protrusions, FIG. 11B is a diagram showing a cross section taken along A-A in FIG. 11A, and FIG. 11C is a diagram showing the conductor wires and the substrate having been extended;

"FIG. 12 is a diagram illustrating an example (Example 1) of a light-emitting device manufacturing method using a rod-winding bending method, in which FIG. 12A is an upper view and a front view of a rod member and a conductor wire wound around the rod member, FIG. 12B is a side view of the rod member and the conductor wire wound around the rod member, and FIG. 12C is an upper view of the conductor wire that has been extended;

"FIG. 13 is a diagram illustrating an example (Example 2) of a light-emitting device manufacturing method using a rod-winding bending method, in which FIG. 13A is an upper view and a front view of a rod member and a conductor wire wound around the rod member (prior to cutting), FIG. 13B is an upper view and a front view of the rod member and the conductor wire wound around the rod member (after cutting), FIG. 13C is an upper view and a front view of the rod member and the conductor wire wound around the rod member (after mounting), and FIG. 13D is an upper view of the conductor wire that has been extended;

"FIG. 14 is a diagram illustrating an example (Example 3) of a light-emitting device manufacturing method using a rod-winding bending method, in which FIG. 14A is a diagram showing how a conductor wire is attached to a substrate using a roller, FIG. 14B is an upper view of a rod member and the conductor wire and the substrate wound around the rod member (prior to cutting), FIG. 14C is an upper view of the rod member and the conductor wire and the substrate wound around the rod member (after cutting), FIG. 141) is an upper view and a front view of the rod member and the conductor wire and the substrate wound around the rod member (after removal of coating), FIG. 14E is an upper view and a front view of the rod member and the conductor wire and the substrate wound around the rod member (after mounting), and FIG. 14F is a diagram showing an example of the extended conductor wire; and

"FIG. 15 is a diagram illustrating an example of a light-emitting device manufacturing method using a rod-cutting bending method, in which FIG. 15A is an upper view and a front view of a rod member and a conductor wire wound around the rod member (prior to cutting), FIG. 15B is an upper view and a front view of the rod member and the conductor wire wound around the rod member (after cutting), FIG. 15C is an upper view and a front view of the conductor wire to which the plurality of light-emitting diodes are mounted, and FIG. 15D is an upper view and a side view of the conductor wire that has been extended."

For additional information on this patent application, see: Marutani, Yukitoshi; Miyata, Tadaaki. Light-Emitting Device Manufacturing Method. Filed July 30, 2013 and posted February 13, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=2766&p=56&f=G&l=50&d=PG01&S1=20140206.PD.&OS=PD/20140206&RS=PD/20140206

Keywords for this news article include: Electronics, Nichia Corporation, Light-emitting Diode.

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Source: Electronics Newsweekly


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