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Researchers Submit Patent Application, "High Speed Optical Transceiver Module", for Approval

February 26, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors LEE, Sang Ho (Gwangju, KR); YUN, Suk Han (Seoul, KR); KIM, Tae Kyun (Chungcheongnam-do, KR); PARK, Joo Ho (Gwangju, KR), filed on November 30, 2012, was made available online on February 13, 2014.

The patent's assignee is OE Solutions Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "There is a problem with existing optical transceiver modules. When an un-cooled optical transceiver module is driven at low temperature, the ambient temperature influences a laser diode (LD) chip, and thus the wavelength of light generated in the LD chip is shifted. That is, when the ambient temperature is lowered during communication using a coarse wavelength division multiplexing (CWDM) scheme, there is a problem in that communication is not possible.

"An auxiliary heater is used to maintain properties of the LD chip even at a lower temperature in an existing structure. In this case, the auxiliary heater is positioned between a radio frequency (RF) transmission line and a printed circuit board (PCB) connection portion. There is a problem in that the position of the auxiliary heater limits the length of the RF transmission line when the optical transceiver module is driven at a high frequency."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Preferred embodiments of the invention relate to a high speed optical transceiver module in which, when communication using a coarse wavelength division multiplexing (CWDM) scheme is implemented, all of pin leads of a laser diode (LD) are electrically isolated from a stem and a stem heat sink, thereby making it possible to prevent interference between channels in a low temperature environment and to facilitate transmission.

"An object of preferred embodiments of the invention is to provide a high speed optical transceiver module in which a micro heater is employed when communication using a CWDM scheme is implemented, so that it is possible to prevent interference between channels in a low temperature environment and to facilitate transmission.

"Another object of preferred embodiments of the invention is to provide a high speed optical transceiver module in which all of pin leads enclosed by glass or an insulator are electrically isolated from a stem and a stem heat sink, thereby reducing electrical noise.

"A further object of preferred embodiments of the invention is to provide a high speed optical transceiver module in which wavelength shift can be prevented to thereby achieve low power and high efficiency by putting a micro heater in a hole formed in a stem heat sink through a lower portion of a stem to compensate for the temperature of an LD chip.

"A still further object of preferred embodiments of the invention is to provide a high speed optical transceiver module, in which since a portion of the stem heat sink is empty, the cross sectional area of the stem is increased and thus heat conduction efficiency is improved, so that if the temperature of the LD chip increases, heat can be easily dissipated without putting an additional micro heater in the stem heat sink, thereby improving the light emitting efficiency and durability of the LD chip.

"A still further object of preferred embodiments of the invention is to provide a high speed optical transceiver module, in which an RF transmission line can be decreased in length as compared with a case where an existing auxiliary heater is used, thereby making it possible to reduce the limitation of the length of the RF transmission line when the optical transceiver module is driven at high frequency.

"In accordance with one aspect, preferred embodiments of the invention provide a high speed optical transceiver module, which makes it possible to prevent a wavelength shift and thus to achieve low power and high efficiency by forming a hole with a predetermined depth in a stem heat sink for dissipating heat generated in an LD through a lower portion of a stem and putting a micro heater in the hole, thereby compensating for the temperature of the LD chip in order to prevent wavelength shift caused by the influence of the ambient temperature on the LD chip in a transistor outline (TO) when an un-cooled optical transceiver module is driven at low temperature and to prevent the communication from being impossible when the ambient temperature is lowered during communication using a CWDM scheme.

"In accordance with another aspect, preferred embodiments of the invention provide a high speed optical transceiver module, which is configured to easily dissipate heat when the temperature of an LD chip increases since the cross sectional area of the stem for dissipating heat generated in the LD chip is increased and thus heat dissipation is efficiently achieved to improve heat conduction efficiency by forming a hole with a predetermined depth in a stem heat sink through a lower portion of a stem.

"In accordance with a further aspect, preferred embodiments of the invention provide a high speed optical transceiver module in which all of pin leads enclosed by glass or an insulator are electrically isolated from a stem and a heat sink, thereby reducing electrical noise in a system.

"In accordance with a still another aspect, preferred embodiments of the invention provide a high speed optical transceiver module, in which the RF transmission line is decreased in length as compared with an existing long RF transmission line using an auxiliary heater, thereby processing data at a high frequency.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIG. 1 is a plan view of a high speed optical transceiver module according to preferred embodiments of the invention;

"FIG. 2 is a side view of the high speed optical transceiver module according to preferred embodiments of the invention;

"FIG. 3 is a bottom view of the high speed optical transceiver module according to preferred embodiments of the invention;

"FIG. 4 shows size, length and position of a hole in the high speed optical transceiver module according to preferred embodiments of the invention; and

"FIG. 5 is a three-dimensional view of the high speed optical transceiver module shown in FIG. 4."

For additional information on this patent application, see: LEE, Sang Ho; YUN, Suk Han; KIM, Tae Kyun; PARK, Joo Ho. High Speed Optical Transceiver Module. Filed November 30, 2012 and posted February 13, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=3798&p=76&f=G&l=50&d=PG01&S1=20140206.PD.&OS=PD/20140206&RS=PD/20140206

Keywords for this news article include: Electronics, Laser Diodes, OE Solutions Co. Ltd.

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Source: Electronics Newsweekly


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