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Researchers Submit Patent Application, "Camera Module and Electronic Device Including the Same", for Approval

February 26, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor CHOI, Yong Nam (Seoul, KR), filed on August 5, 2013, was made available online on February 13, 2014.

The patent's assignee is Lg Innotek Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The teachings in accordance with exemplary and non-limiting embodiments of this disclosure relate generally to a camera module and an electronic device including the camera module.

"This section provides background information related to the present disclosure which is not necessarily prior art.

"In general, a camera module includes a lens unit including lenses, a housing coupled to the lens unit and a sensor unit including an IR (Infrared) filter and an image sensor. The camera module is recently mounted on a mobile phone to perform a function of capturing an image of an object. The image sensor is mounted on a PCB (Printed Circuit Board), where the housing and the PCB are bonded using an adhesive to allow a camera module to be assembled.

"A conventional camera module suffers from disadvantages in that a packaging cost of a COB (Chip On Board) sensor in a CSP (Chip Scale Package) type increases and a device mounting space is hard to obtain due to a reflowable lens being directly mounted on the CSP.

"Another disadvantage is that the conventional COB type requires a separate FPCB (Flexible PCB) when a substrate and a set (mother board) are connected, resulting in creation of additional components and complexity in connection structure."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "This section provides a general summary of the disclosure, and is not a comprehensive disclosure of its full scope or all of its features.

"The present disclosure provides a camera module and an electronic device including the same.

"It should be emphasized, however, that the present disclosure is not limited to a particular disclosure, as explained above. It should be understood that other technical subjects not mentioned herein may be appreciated by those skilled in the art.

"In one general aspect of the present disclosure, there is provided a camera module, the camera module comprising:

"one or more pieces of lenses;

"a housing formed therein with the one or more pieces of lenses; and

"a PCB (Printed Circuit Board) fixed to the housing, mounted with an image sensor converting an optical image having passed the one or more pieces of lenses to an electrical signal and formed at a bottom surface using a solder ball.

"Preferably, but not necessarily, the housing may be coupled to the PCB by bonding.

"Preferably, but not necessarily, a circuit element may be mounted on the PCB inside the housing.

"Preferably, but not necessarily, the circuit element may be a passive element.

"Preferably, but not necessarily, a lug may be formed at a housing area fixed to the PCB a groove or a through hole inserted by the lug is formed on the PCB.

"Preferably, but not necessarily, the groove or the through hole may be formed in a plural number on the PCB.

"Preferably, but not necessarily, the lug of the housing may be formed in the same number as that of the groove or the through hole.

"Preferably, but not necessarily, the groove or the through hole may be formed at a mutually symmetrical position.

"Preferably, but not necessarily, the lug may be formed in a length protruded from a floor surface of the PCB, in a case the housing and the PCB are coupled.

"Preferably, but not necessarily, the length of the lug may be formed shorter than a height from the PCB of the solder ball.

"Preferably, but not necessarily, the one or more pieces of lenses and the housing may be manufactured with a WLO (Wafer Level Optic) that is a wafer optical element.

"In another general aspect of the present disclosure, there is provided an electronic device, the electronic device comprising: one or more pieces of lenses; a housing formed therein with the one or more pieces of lenses;

"a camera module including a PCB (Printed Circuit Board) fixed to the housing, mounted with an image sensor converting an optical image having passed the one or more pieces of lenses to an electrical signal and formed at a bottom surface with a solder ball; and

"a second substrate coupled to the camera module using the solder ball.

"Preferably, but not necessarily, the camera module may be coupled by being reflowed using the solder ball.

"Preferably, but not necessarily, the second substrate may be a mother board.

"Preferably, but not necessarily, the mother board may be a mother board of display module.

"Preferably, but not necessarily, the one or more pieces of lenses and the housing may be manufactured with a WLO (Wafer Level Optic) that is a wafer optical element.

"The exemplary embodiment of the present disclosure is advantageously configured such that a camera module itself can be directly mounted on a mother board by fixing a housing installed with camera components to a PCB formed with a solder ball.

"Furthermore, the exemplary embodiment of the present disclosure is advantageously configured such that a cost for packaging a camera module using a CSP (Chip Scale Package) of a conventional image sensor can be reduced.

"In addition, the exemplary embodiment of the present disclosure is advantageously configured such that a solder ball can be formed at a bottom surface of a PCB mounted with an image sensor to enable a reflow, whereby a circuit element can be mounted on the PCB.

"Still furthermore, the exemplary embodiment of the present disclosure is advantageously configured such that a lug provided on a housing can be inserted into a groove or a through hole to enable an easy optical alignment of a lens of the housing and an image sensor mounted on a PCB.

BRIEF DESCRIPTION OF THE DRAWINGS

"In order to explain the principle of the present disclosure, some accompanying drawings related to its preferred embodiments are below reported for the purpose of illustration, exemplification and description, although they are not intended to be exhaustive. The drawing figures depict one or more exemplary embodiments in accordance with the present concepts, by way of example only, not by way of limitations. In the figures, like reference numerals refer to the same or similar elements.

"FIG. 1 is a schematic lateral cross-sectional view of a camera module according to an exemplary embodiment of the present disclosure.

"FIG. 2 is a schematic lateral cross-sectional view for explaining a detailed configuration of a camera module according to an exemplary embodiment of the present disclosure.

"FIG. 3 is a schematic lateral cross-sectional view for explaining a coupled state between a housing and a PCB of a camera module according to an exemplary embodiment of the present disclosure.

"FIG. 4 is a schematic plane view illustrating a PCB of FIG. 3.

"FIG. 5 is a schematic lateral cross-sectional view for explaining a coupled state between a housing and a PCB of a camera module according to another exemplary embodiment of the present disclosure.

"FIG. 6 is a partial cross-sectional view illustrating a state where a lug of FIG. 5 is evenly bonded with solder balls."

For additional information on this patent application, see: CHOI, Yong Nam. Camera Module and Electronic Device Including the Same. Filed August 5, 2013 and posted February 13, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4945&p=99&f=G&l=50&d=PG01&S1=20140206.PD.&OS=PD/20140206&RS=PD/20140206

Keywords for this news article include: Electronics, Circuit Board, Lg Innotek Co. Ltd.

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Source: Electronics Newsweekly


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