News Column

Patent Issued for Signal Conversion Device with Dual Chip

February 25, 2014



By a News Reporter-Staff News Editor at Journal of Technology -- A patent by the inventors Hsiao, Feng Chi (Taipei, TW); Yang, Kun Shan (Taipei, TW); Lin, Tung Fu (Taipei, TW); Cheng, Chin Fen (Taipei, TW); Lee, Chih Wei (Taipei, TW), filed on May 26, 2010, was published online on February 11, 2014, according to news reporting originating from Alexandria, Virginia, by VerticalNews correspondents.

Patent number 8649184 is assigned to Phytrex Technology Corporation (Taipei, TW).

The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to a dual chip signal conversion device applicable to the Subscriber Identify Module (SIM), and more particularly, to the technical field regarding the integration of dual cards.

"According to the National Communications Commission (NCC), there were 24.68 million mobile phone subscribers in Taiwan by the end of June, 2008, that is, everyone in the country had more than one mobile phone. The phenomenal popularity of mobile phones in Asia indicates that the mobile phone has become an essential device for both personal and professional use. While some may use the mobile phone to take photos and listen to music, the majority of mobile phone users simply use the gadget to make/receive phone calls and send/receive messages. Currently, a SIM card is used in a mobile phone to store the user's phone number, phone book and system information, such as the Personal Identification Number (PIN) code and user ID, and to perform antitheft function, access control function, etc. However, people's heavy reliance on mobile phones gives rise to the needs to integrate the near field communication (NFC) functions, such as the functions of EasyCard, credit card and entrance card, into a SIM card. Near Field Communication or NFC is a short-range high frequency wireless communication technology which enables two electronic devices to access/read in data from contactless cards through contactless point to point communication, thereby to safely exchange data.

"As the integration of relevant value-added services to a SIM card without changing the structure of the SIM card is industrially applicable, the present invention provides a dual chip signal conversion device."

In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "The present invention provides a dual chip signal conversion device in which a thin film carrier may be provided with two chips and an antenna so as to be attached to a SIM card.

"To achieve the aforementioned object, the present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.

"To achieve the aforementioned object, the present invention provides another dual chip signal conversion device, comprising: a carrier comprising a first substrate, a second substrate and a connecting portion for connecting the first and second substrates, one side surface of the first substrate being provided with at least a first contact and a second contact while the other side surface of the first substrate being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a first chip disposed at one side surface of the second substrate and electrically connected to the second and fourth contacts via the connecting portion; a second chip disposed at one side surface of the second substrate and electrically connected to the first chip; and an antenna disposed within the second substrate and electrically connected to the second chip.

"To achieve the aforementioned object, the present invention provides yet another dual chip signal conversion device, comprising: a carrier comprising a first substrate, a second substrate and a connecting portion for connecting the first and second substrates, one side surface of the first substrate being provided with at least a first contact and a second contact while the other side surface of the first substrate being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a first chip disposed at one side surface of the first substrate and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the second substrate and electrically connected to the first chip via the connecting portion; and an antenna disposed within the second substrate and electrically connected to the second chip.

"To achieve the aforementioned object, the present invention provides yet another dual chip signal conversion device, comprising: a carrier comprising a first substrate, a second substrate and a connecting portion for connecting the first and second substrates, one side surface of the first substrate being provided with at least a first contact and a second contact while the other side surface of the first substrate being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a first chip disposed at one side surface of the first substrate and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the first substrate and electrically connected to the first chip; and an antenna disposed within the second substrate and electrically connected to the second chip via the connecting portion.

"To achieve the aforementioned object, the present invention provides yet another dual chip signal conversion device, comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate having a plurality of electrical contacts; a connecting portion for connecting the first and second substrates; a third substrate having a plurality of electrical contacts; a first chip disposed at one side surface of the second substrate, the first chip being electrically connected to the second and fourth contacts via the connecting portion and to the plurality of electrical contacts of the second substrate; a second chip disposed at one side surface of the third substrate and electrically connected to the plurality of electrical contacts of the third substrate; and an antenna disposed within the third substrate and electrically connected to the second chip; wherein the second and third substrates are electrically connected via their respective plurality of electrical contacts.

"To achieve the aforementioned object, the present invention provides yet another dual chip signal conversion device, comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate having a plurality of electrical contacts; a connecting portion for connecting the first and second substrates; a third substrate having a plurality of electrical contacts; a first chip disposed at one side surface of the second substrate and electrically connected to the second and fourth contacts via the connecting portion; a second chip disposed at one side surface of the second substrate, the second chip being electrically connected to the first chip and to the plurality of electrical contacts of the second substrate; and an antenna disposed within the third substrate and electrically connected to the plurality of electrical contacts of the third substrate; wherein the second and third substrates are electrically connected via their respective plurality of electrical contacts.

"To achieve the aforementioned object, the present invention provides yet another dual chip signal conversion device, comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate having a plurality of electrical contacts; a connecting portion for connecting the first and second substrates; a third substrate having a plurality of electrical contacts; a first chip disposed at one side surface of the first substrate and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the second substrate, the second chip being electrically connected to the first chip via the connecting portion and to the plurality of electrical contacts of the second substrate; and an antenna disposed within the third substrate and electrically connected to the plurality of electrical contacts of the third substrate; wherein the second and third substrates are electrically connected via their respective plurality of electrical contacts.

"The aforementioned first chip is a signal processing unit.

"The aforementioned second chip is an authentication unit which executes the encryption/decryption algorithm authenticated by the bank.

"The aforementioned first and second chips are fabricated using Wafer Level Chip Scale Package (WLCSP) or chip on film (COF) technology.

"The aforementioned first chip converts the signals, which include data signals, between the second and fourth contacts.

"The aforementioned first and third contacts electrically connect to electrical grounding.

"The aforementioned first and third contacts electrically connect to power source.

"The aforementioned first and second contacts are configured to electrically connect to a SIM card.

"The aforementioned third and fourth contacts are configured to electrically connect to a portable communication device.

"The aforementioned second substrate has a plurality of electrical contacts consisting of at least a pair of electrical contacts."

URL and more information on this patent, see: Hsiao, Feng Chi; Yang, Kun Shan; Lin, Tung Fu; Cheng, Chin Fen; Lee, Chih Wei. Signal Conversion Device with Dual Chip. U.S. Patent Number 8649184, filed May 26, 2010, and published online on February 11, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=39&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1910&f=G&l=50&co1=AND&d=PTXT&s1=20140211.PD.&OS=ISD/20140211&RS=ISD/20140211

Keywords for this news article include: Phytrex Technology Corporation.

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Source: Journal of Technology


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