Patent number 8648368 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "A widespread problem for optoelectronic components having a passivation layer is that instances of damage such as for example cracks which form in a part of the passivation layer can continue over the entire passivation layer. Thus, cracks can be formed, for example, if many optoelectronic components which are arranged on a common substrate and separated from one another by separating trenches in the substrate are singulated by for example sawing. These cracks in the separating trench can continue as far as the semiconductor layer and lead, inter alia, to accelerated aging on account of the ingress of moisture. Moisture can pass through the cracks into the semiconductor layer and cause there a short circuit of the component.
"It could therefore be helpful to provide an optoelectronic component whose passivation layer has improved protection in the region of the semiconductor layer."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventor's summary information for this patent: "I provide an optoelectronic component, including a carrier, a metallic mirror layer arranged on the carrier, a first passivation layer arranged on a region of the metallic mirror layer, a semiconductor layer that generates an active region during electrical operation arranged on the first passivation layer, a second passivation layer comprising two regions, wherein the first region is arranged on a top face of the semiconductor layer, and the second region which is free of the semiconductor layer is arranged on the metallic mirror layer; and wherein the first and second regions are separated from one another by a region which surrounds the first passivation layer and which is free of the second passivation layer.
"I also provide a thin-film LED chip including the optoelectronic component.
"I further provide a method for producing an optoelectronic component including A) providing a layer arrangement including a carrier, a metallic mirror layer, a first passivation layer and a semiconductor layer, B) removing a part of the first passivation layer, C) applying a second passivation layer on a top face of the semiconductor layer and on the metallic mirror layer, wherein a first region of the second passivation layer is produced on the top face of the semiconductor layer and a second region of the second passivation layer is produced on the mirror layer, and a region is formed which surrounds the first passivation layer and which is free of the second passivation layer separating the first region and the second region from one another."
URL and more information on this patent, see: Weimar, Andreas. Optoelectronic Component with a Protected Passivation Layer. U.S. Patent Number 8648368, filed
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