Patent number 8648478 is assigned to
The following quote was obtained by the news editors from the background information supplied by the inventors: "The inventive concept relates to heat sinks and to semiconductor packages including the same.
"With the rapid technological development of electronic devices, semiconductor chips are increasingly becoming more highly integrated and miniaturized. While operating at high speed, small and highly integrated semiconductor chips give off a lot of heat, thereby raising the temperature of peripheral circuits. This high-temperature environment may degrade the performance of the peripheral circuits and adversely affect product reliability. Therefore, heat sinks are being used to dissipate heat from semiconductor chips."
In addition to the background information obtained for this patent, VerticalNews journalists also obtained the inventors' summary information for this patent: "According to one aspect of the inventive concept, there is provided a heat sink comprising a first adhesive layer, and a heat dissipation layer juxtaposed with and bonded to the first adhesive layer, and wherein the heat sink has ventilation ports each extending therethrough including through the first adhesive layer and the heat dissipation layer.
"According to another aspect of the present invention, there is provided a semiconductor package comprising a substrate having opposite upper and lower surfaces, a semiconductor chip mounted to the substrate, and a heat sink covering the semiconductor chip and constituting an outermost portion of the package. The heat sink comprises a first adhesive layer, and a heat dissipation layer disposed on and bonded to the first adhesive layer, and the heat sink has ventilation ports each extending through the first adhesive layer and the heat dissipation layer.
"According to another aspect of the inventive concept, there is provided a semiconductor package comprising a substrate having upper and lower major surfaces, a semiconductor chip disposed on the upper surface of the substrate, a molding layer disposed on the substrate and in which the chip is embedded, and a heat sink comprising a first adhesive layer disposed on the molding layer, and a heat dissipation layer disposed on and bonded to the first adhesive layer, and wherein the heat sink has ventilation ports each extending through the first adhesive layer and the heat dissipation layer."
URL and more information on this patent, see: Yoo, Jae-Wook; Choi, Kyoung-Sei; Cho, Eun-Seok; Choi, Mi-Na; Hwang, Hee-Jung; Bae, Se-Ran. Flexible Heat Sink Having Ventilation Ports and Semiconductor Package Including the Same. U.S. Patent Number 8648478, filed
Keywords for this news article include: Semiconductor,
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