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International Business Machines Assigned Patent for Method of Forming Substrate Contact for Semiconductor on Insulator (SOI) Substrate

February 17, 2014



By Targeted News Service

ALEXANDRIA, Va., Feb. 17 -- International Business Machines, Armonk, N.Y., has been assigned a patent (8,647,945) developed by six co-inventors for a "method of forming substrate contact for semiconductor on insulator (SOI) substrate." The co-inventors are Geng Wang, Stormville, N.Y., Roger A. Booth Jr., Wappingers Falls, N.Y., Kangguo Cheng, Guilderland, N.Y., Joseph Ervin, New York, Chengwen Pei, Danbury, Conn., and Ravi M. Todi, Poughkeepsie, N.Y.

The patent application was filed on Dec. 3, 2010 (12/959,824). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=4&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=169&f=G&l=50&co1=AND&d=PTXT&s1=20140211.PD.&s2=%28NY.ASST.%29&OS=ISD/02/11/2014+AND+AS/NY&RS=ISD/02/11/2014+AND+AS/NY

Written by Sudarshan Harpal; edited by Jaya Anand.

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Source: Targeted News Service


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