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Researchers Submit Patent Application, "Thermally Conductive Led Assembly", for Approval

February 19, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventors Meis, Michael A. (Stillwater, MN); Korpela, Susan L. (Woodbury, MN); Janssen, Jeffrey R. (Woodbury, MN); Hager, Patrick J. (Woodbury, MN); Aeling, Ellen O. (Oakdale, MN), filed on October 3, 2013, was made available online on February 6, 2014.

The patent's assignee is 3m Innovative Properties Company.

News editors obtained the following quote from the background information supplied by the inventors: "The present disclosure relates generally to thermally conductive LED assemblies.

"Light emitting diodes (LEDs) are small solid state light emitting devices that are finding many applications as illumination sources because of their rugged design and long lifetime. However, due to the small size of the LED devices, when they are operated at maximum power, they can generate considerable heat in a small, localized area. As the operating temperature of these LEDs rise, the performance and life expectancy of the LEDs degrade due to elevated temperature effects."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "This disclosure describes thermally conductive LED assemblies. The disclosure herein allows for enhanced operation and performance of LEDs that create a large amount of heat by allowing this heat to be removed from the local area of each LED. This heat can be removed, for example, by radiation or conduction. In this way, LEDs operating at maximum power provide maximum light output and operate to expected lifetimes. In addition, the assemblies described herein can allow for more high power LEDs to be operated along a flexible cable than with conventional wiring systems because such assemblies can dissipate heat effectively.

"In one aspect, the present disclosure provides a thermally conductive LED assembly that includes an elongate conductor cable having a first conductor and a second conductor extending along a length of the elongate conductor cable and a thermally conducting and electrically insulating polymer layer disposed between first conductor and second conductor and a second electrically insulating polymer layer is disposed on the first conductor or second conductor. The electrically insulating polymer layer having a thermal impedance value in a range from 2.5 to 15 C.degree.-cm2/W and a plurality of light emitting diodes are disposed along the length of the elongate conductor cable. Each light emitting diode is in electrical communication with the first conductor and the second conductor.

"In another aspect, the present disclosure provides a method of forming a thermally conductive LED assembly that includes disposing a thermally conductive and electrically insulating polymer layer between a first conductor and second conductor and disposing a second electrically insulating polymer layer on the first conductor or second conductor to form a length of an elongate conductor cable and placing a plurality of LEDs on the length of elongate conductor cable. The thermally conductive and electrically insulating polymer layer having a thermal impedance value in a range from 2.5 to 15 C.degree.-cm2/W and each LED is in electrical connection with the first conductor and the second conductor to form a thermally conductive LED assembly.

"These and other aspects of the thermally conductive LED assembly according to the subject disclosure will become readily apparent to those of ordinary skill in the art from the following detailed description together with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

"So that those having ordinary skill in the art to which the subject invention pertains will more readily understand how to make and use the subject disclosure, exemplary embodiments thereof will be described in detail below with reference to the drawings, in which:

"FIG. 1 is a schematic cross-sectional diagram of one illustrative thermally conductive LED assembly;

"FIG. 2 is a schematic cross-sectional diagram of another illustrative thermally conductive LED assembly;

"FIG. 3 is a schematic top view of FIG. 1;

"FIG. 4 is a schematic cross-sectional diagram of another illustrative thermally conductive LED assembly;

"FIG. 5 is a schematic top view of another illustrative thermally conductive LED assembly; and

"FIG. 6 is a schematic cross-sectional view of the thermally conductive LED assembly illustrated in FIG. 5 and taken along lines 6-6."

For additional information on this patent application, see: Meis, Michael A.; Korpela, Susan L.; Janssen, Jeffrey R.; Hager, Patrick J.; Aeling, Ellen O. Thermally Conductive Led Assembly. Filed October 3, 2013 and posted February 6, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=5214&p=105&f=G&l=50&d=PG01&S1=20140130.PD.&OS=PD/20140130&RS=PD/20140130

Keywords for this news article include: Electronics, Light-emitting Diode, 3m Innovative Properties Company.

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Source: Electronics Newsweekly


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