Patent Issued for
The patent's assignee for patent number 8643178 is
News editors obtained the following quote from the background information supplied by the inventors: "As portable electronic devices become smaller, the dimensions of semiconductor chip packages must be reduced. In order to reduce the dimensions of the semiconductor chip packages, various packaging technologies have been developed. In addition, in order to implement high-performance requirements for the semiconductor chip packages, it may be required to form bonding pads in contact with solder balls or bonding wires at desired positions, regardless of the chip pad locations formed on a semiconductor chip. In this case, the bonding pads are electrically connected to the chip pads through redistributed metal interconnections.
"A semiconductor chip having redistributed metal interconnections is disclosed in U.S. Pat. No. 6,211,576 B1 to
As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "In one embodiment, the invention is directed to semiconductor chips having a redistributed metal interconnection. The semiconductor chips of this embodiment include an internal circuit and a chip pad formed on a semiconductor substrate. The chip pad is electrically connected to the internal circuit through an internal interconnection. A passivation layer is provided over the chip pad and the internal interconnection. A redistributed metal interconnection is provided on the passivation layer. The redistributed metal interconnection is directly connected to the internal interconnection and the chip pad through a via-hole and a chip pad opening, respectively, which penetrate the passivation layer."
For additional information on this patent, see: Lee, Jong-Joo.
Keywords for this news article include: Semiconductor,
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