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Patent Issued for Semiconductor Chips Having Redistributed Power/Ground Lines Directly Connected to Power/Ground Lines of Internal Circuits and...

February 19, 2014



Patent Issued for Semiconductor Chips Having Redistributed Power/Ground Lines Directly Connected to Power/Ground Lines of Internal Circuits and Methods of Fabricating the Same

By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventor Lee, Jong-Joo (Gyeonggi-do, KR), filed on February 25, 2013, was published online on February 4, 2014.

The patent's assignee for patent number 8643178 is Samsung Electronics Co., Ltd. (Suwon-si, Gyeonggi-do, KR).

News editors obtained the following quote from the background information supplied by the inventors: "As portable electronic devices become smaller, the dimensions of semiconductor chip packages must be reduced. In order to reduce the dimensions of the semiconductor chip packages, various packaging technologies have been developed. In addition, in order to implement high-performance requirements for the semiconductor chip packages, it may be required to form bonding pads in contact with solder balls or bonding wires at desired positions, regardless of the chip pad locations formed on a semiconductor chip. In this case, the bonding pads are electrically connected to the chip pads through redistributed metal interconnections.

"A semiconductor chip having redistributed metal interconnections is disclosed in U.S. Pat. No. 6,211,576 B1 to Shimizu, et al., entitled 'Semiconductor Device'. According to Shimizu, et al., a power wiring section, a ground wiring section, and a signal wiring section are provided at the same level, and the power wiring section or the ground wiring section is formed adjacent to both sides of at least one portion of the signal wiring section."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "In one embodiment, the invention is directed to semiconductor chips having a redistributed metal interconnection. The semiconductor chips of this embodiment include an internal circuit and a chip pad formed on a semiconductor substrate. The chip pad is electrically connected to the internal circuit through an internal interconnection. A passivation layer is provided over the chip pad and the internal interconnection. A redistributed metal interconnection is provided on the passivation layer. The redistributed metal interconnection is directly connected to the internal interconnection and the chip pad through a via-hole and a chip pad opening, respectively, which penetrate the passivation layer."

For additional information on this patent, see: Lee, Jong-Joo. Semiconductor Chips Having Redistributed Power/Ground Lines Directly Connected to Power/Ground Lines of Internal Circuits and Methods of Fabricating the Same. U.S. Patent Number 8643178, filed February 25, 2013, and published online on February 4, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=69&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3431&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&OS=ISD/20140204&RS=ISD/20140204

Keywords for this news article include: Semiconductor, Samsung Electronics Co. Ltd..

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Source: Electronics Newsweekly


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