News Column

Patent Issued for Multi-Channel Package and Electronic System Including the Same

February 19, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- Samsung Electronics Co., Ltd. (Suwon-si, Gyeonggi-do, KR) has been issued patent number 8643175, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Kim, Kil-Soo (Hwaseong-si, KR); Youn, Sun-Pil (Seoul, KR).

This patent was filed on July 5, 2012 and was published online on February 4, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "The inventive concept relates to semiconductor packages. More particularly, the inventive concept relates to multi-channel packages and to electronic device including a multi-channel package.

"Although semiconductor devices are being scaled down to meet such demands as the demand for smaller and smaller electronic products, the semiconductor devices must still be able to process very large amounts of data. Accordingly, i.e., to meet such demands, semiconductor chips of today's electronic products need to be highly integrated and incorporated into a single package. Moreover, in addition to the need for highly integrated semiconductor chips, there is a demand for chips that offer better performance and greater reliability. Similarly, there is an ever increasing demand for electronic systems that operate at higher speeds."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "According to an aspect of the inventive concept, there is provided a multi-channel package having at least four channels and comprising a package substrate having a first surface and a second surface, 4n semiconductor chips mounted to the package substrate on the first surface thereof, wherein n is a positive integer, and a plurality of external connection terminals on the second surface of the package substrate. Each of the channels constitutes a discrete path in the package associated with and along which signals are transmitted to/from a respective one or group of the semiconductor chips in the package. Also, each of the channels is discrete and independent from the other channels in the package such that each of the chips can transmit/receive signals to/from the external connection terminals via only one of the channels amongst the at least four channels.

"According to an aspect of the inventive concept, there is provided an electronic system comprising a main board including wiring, at least one multi-channel package having at least four channels and mounted to the main board, and a controller package mounted on the main board. The controller package has 4n channels wherein n is an integer equal to or greater than 2. Each multi-channel package comprises at least four semiconductor chips, and external connection terminals by which the package is electrically connected to the main board. Also, each of the channels of the multi-channel package constitutes a discrete path in the package associated with and along which signals are transmitted to/from a respective one or a group of the semiconductor chips in the package, and each of the channels is discrete and independent from the other channels in the package. Therefore, each of the chips can transmit/receive signals to/from the external connection terminals via only one of the channels. Respective ones of the channels of the controller package are connected by the wiring of the main board to respective ones of the channels of the at least one multi-channel package.

"According to another aspect of the inventive concept there is provided an electronic device comprising a main board including a wiring pattern of discrete wires, at least one multi-channel package having at least four channels mounted to the main board, and a controller package mounted on the main board. Each multi-channel package includes a package substrate having a first surface and a second surface, 4n semiconductor chips mounted to the package substrate on the first surface thereof, wherein n is a positive integer, and a plurality of external connection terminals on the second surface of the package substrate and by which the multi-channel package is electrically connected to the wiring of the main board. The controller package has a number of channels equal to the total number of channels of the multi-channel package or packages mounted to the main board, and the channels of the controller package are connected to the channels of the at least one multi-channel package, respectively, by the wires of the wiring pattern of the main board, respectively."

For the URL and additional information on this patent, see: Kim, Kil-Soo; Youn, Sun-Pil. Multi-Channel Package and Electronic System Including the Same. U.S. Patent Number 8643175, filed July 5, 2012, and published online on February 4, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=69&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=3434&f=G&l=50&co1=AND&d=PTXT&s1=20140204.PD.&OS=ISD/20140204&RS=ISD/20140204

Keywords for this news article include: Semiconductor, Samsung Electronics Co. Ltd..

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Source: Electronics Newsweekly


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