First NSX 320 Metrology system sold specifically for TSV application
includes specialized sensors to measure critical parameters in 3D
“Controlling the processes used to create TSVs requires a number of specialized measurements, such as the total thickness variation (TTV) of the wafer bonded to the carrier, or the remaining silicon thickness after thinning,” said SÉverine Cheramy, CEA-Leti’s director of 3D integration development in the Nanoelec RTI program. “The NSX system’s 3D metrology capabilities, which combine accurate 2D measurements with the ability to see and measure front, back and internal interface surfaces, will provide critical information for our TSV development program.”
Rudolph’s NSX TSV metrology systems combine the NSX family’s well-established 2D inspection capabilities with an advanced 3D metrology that was developed at recently-acquired Tamar Technology. Together, they allow the NSX metrology system to perform a wide variety of measurements needed to characterize and control TSV processes, including TSV depth measurements, bottom CD measurements, pre- and post-thinning remaining silicon thickness measurements during the reveal process, copper nail height measurements, edge trim monitoring, adhesive TTV of bonded pairs and product wafers, and traditional defect inspection throughout the entire process.
For more information about Rudolph’s NSX Metrology Series, please visit www.rudolphtech.com.
By creating innovation and transferring it to industry, Leti is the bridge between basic research and production of micro- and nanotechnologies that improve the lives of people around the world. Backed by its portfolio of 2,200 patents, Leti partners with large industrials, SMEs and startups to tailor advanced solutions that strengthen their competitive positions. It has launched more than 50 startups. Its 8,000m² of new-generation cleanroom space feature 200mm and 300mm wafer processing of micro and nano solutions for applications ranging from space to smart devices. Leti’s staff of more than 1,700 includes 200 assignees from partner companies. Leti is heading the Nanoelec RTI program which benefits from
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Pierre-Damien Berger, +33 4 38 78 02 26