No assignee for this patent application has been made.
Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to a probe card and, more particularly, to a probe card having improved electrical characteristics and mechanical durability of a portion where the probe needle and bump electrode of the probe card come into contact with each other.
"In general, when fabricating electrical circuit devices, such as semiconductor integrated circuit devices, a test is performed in order to check whether or not the electrical characteristics of the electrical circuit device coincide with a design.
"Equipment used in this test is a semiconductor test device (or probe station), and a probe card is mounted on this equipment. The probe card functions to deliver various electrical signals within the semiconductor test device to a semiconductor device to be tested.
"An integrated circuit for driving a Liquid crystal display Driver Integrated circuit (LDI) can be configured in a
"The final test process is performed using a tester in which various measurement devices are embedded in a computer, that is, a semiconductor test device, and a prober station on which a probe card capable of electrically contacting a semiconductor device having a COF form, that is, the subject of test, is mounted.
"From among probe cards, a vertical type probe card is being used a lot because of advantages in that the vertical type probe card can perform a probe test on several semiconductor devices having a finer pitch at the same time, as compared with a cantilever type probe card, and the vertical type probe card is cheaper than a probe card using an MEMS method.
"Unlike in the probe needles of the cantilever type probe card, in the vertical type probe card, the lower ends of probe needles coming into contact with the contact points of a semiconductor device have a vertical form. Furthermore, in the vertical type probe card, connection wires that couple the board and bump electrodes of the probe card and the probe needles can be made of materials having excellent electrical conductivity and processing property.
"A contact property between the bump electrodes and connection wires of this interposer board can be significantly deteriorated over time due to repeated contacts with semiconductor devices. That is, a problem, such as that a contact portion is abraded or deformed or is contaminated by alien substances, can occur.
"The contact property problem of the probe needles or contact parts thereof according to use of the probe card can be connected directly with the durability of the entire probe card."
In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventor's summary information for this patent application: "Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and an object of the present invention is to provide a probe card having an improved contact property between the probe needle and bump electrode of the probe card, which come into contact with each other.
"In accordance with an aspect of the present invention, the above and other objects can be accomplished by the provision of probe card comprising an interface board having an opening and a circuit part, a plurality of connection wires configured to have first ends bonded to contact points of the circuit part of the interface board, an interposer configured to have the connection wires penetrate through the interposer and to have second ends of the connection wires exposed from a bottom surface of the interposer, thus forming bump electrodes, and placed in the opening of the interface board, a plurality of probe needles configured to have upper ends connected to the respective bump electrodes provided on the bottom surface of the interposer and to have lower ends extended downward and at least one support plate configured to have the probe needles inserted into and mounted on the support plate so that the upper ends of the probe needles are exposed upward from the support plate and the lower ends of the probe needles are exposed downward from the support plate, wherein the upper end of each of the probe needles connected to the bump electrodes of the interposer comprises a rhodium plating layer plated with rhodium.
"And The probe needle may be a cobra type probe needle.
"And the upper end of the probe needle may be plated with nickel and then plated with rhodium.
"And the bump electrodes of the interposer may be plated with rhodium.
"And The bump electrodes may be plated with nickel and then plated with rhodium.
"And the probe needle may comprise palladium as an alloy component, and the palladium is 20 to 50 wt %.
"And the alloy component of the probe needle may further comprise copper (Cu) or silver (Ag).
"And the upper end of the probe needle may be subject to rounding processing and then plated with rhodium.
"And the thickness of the rhodium plating layer of the probe needle may be 0.5 to 2.5 .mu.m.
"And the thickness of the nickel plating layer of the probe needle may be 0.5 to 2.5 .mu.m.
"And the thickness of the nickel or rhodium plating layer of the bump electrode of the interposer may be 0.5 to 2.5 .mu.m.
"And the plating of the probe needles is dipped into an electro bath in a state in which a plurality of the probe needles is mounted on a jig for plating.
"And the support plate may comprise an upper support plate and a lower support plate and comprises a hollow part between the upper support plate and the lower support plate.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 shows an example of semiconductor devices to be tested using a probe card according to the present invention;
"FIG. 2 is a perspective view of the probe card according to the present invention;
"FIG. 3 is an exploded perspective view of the probe card according to the present invention;
"FIG. 4 is a cross-sectional view of the probe card shown in FIG. 3;
"FIG. 5 shows a process of molding a probe needle according to the present invention;
"FIG. 6 is a photographed image of the top surface 'hes' of the probe needle according to the present invention; and
"FIGS. 7 and 8 are enlarged cross-sectional views of a portion where the probe needle and bump electrode of the probe card come into contact with each other according to the present invention."
For more information, see this patent application: HAN, Chung-Soo. Probe Card. Filed
Keywords for this news article include: Patents, Electronics, Semiconductor.
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