The patent's assignee is
News editors obtained the following quote from the background information supplied by the inventors: "Embodiments of the invention generally relate to a semiconductor processing chamber, more specifically, to an adhesive material suitable for joining semiconductor processing chamber components.
"Semiconductor processing involves a number of different chemical and physical processes whereby minute integrated circuits are created on a substrate. Layers of materials which make up the integrated circuit are created by chemical vapor deposition, physical vapor deposition, epitaxial growth, and the like. Some of the layers of material are patterned using photoresist masks and wet or dry etching techniques. The substrate utilized to form integrated circuits may be silicon, gallium arsenide, indium phosphide, glass, or any other appropriate materials.
"A typical semiconductor processing chamber may have many components. Some components include a chamber body defining a process zone, a gas distribution assembly adapted to supply a process gas from a gas supply into the process zone, a gas energizer, e.g., a plasma generator, utilized to energize the process gas within the process zone, a substrate support assembly, and a gas exhaust. Some components may be comprised of an assembly of parts. For example, a showerhead assembly may include a conductive base plate adhesively bonded to a ceramic gas distribution plate. Effective bonding of the parts requires a suitable adhesive and a unique bonding technique to ensure that the parts are securely attached to each other while compensating for any mismatch in thermal expansion and without adversely creating any interfacial defects.
"Therefore, there is a need for a robust adhesive material utilized to assemble parts and/or components in a semiconductor processing chamber."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "Embodiments of the invention provide a robust adhesive material suitable for joining semiconductor processing chamber components. In one embodiment, an adhesive material suitable for joining semiconductor chamber components includes an adhesive material having a Young's modulus lower than 300 psi.
"In another embodiment, a semiconductor chamber component includes a first surface disposed adjacent a second surface, and an adhesive material coupling the first and second surfaces, wherein the adhesive material has a Young's modulus lower than 300 psi.
"In yet another embodiment, a method for bonding semiconductor processing chamber components includes applying an adhesive material on a surface of a first component, wherein the adhesive material has a Young's modulus lower than 300 psi, coupling a second component to the surface of the first component through contact with the adhesive material, and thermally processing the adhesive layer coupling the first and the second component.
BRIEF DESCRIPTION OF THE DRAWINGS
"So that the manner in which the above recited features of the present invention can be understood in detail, a more particular description of the invention, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the appended drawings.
"FIG. 1 depicts a sectional view of one embodiment of a processing chamber using a bonding material according the present invention;
"FIG. 2 depicts a sectional view of one embodiment with substrates being bound by an adhesive material according the present invention; and
"FIG. 3 depicts an exploded sectional view of one embodiment with substrates being bound by a perforated sheet of adhesive material according the present invention.
"It is to be noted, however, that the appended drawings illustrate only typical embodiments of this invention and are therefore not to be considered limiting of its scope, for the invention may admit to other equally effective embodiments.
"To facilitate understanding, identical reference numerals have been used, wherever possible, to designate identical elements that are common to the figures. It is contemplated that elements of one embodiment may be advantageously utilized in other embodiments without further recitation."
For additional information on this patent application, see: Sun, Jennifer Y.; Banda, Sumanth. Adhesive Material Used for Joining Chamber Components. Filed
Keywords for this news article include: Electronics, Semiconductor,
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