The patent's inventors are Sugiura, Miharu (Fujikawaguchiko-machi, JP);
This patent was filed on
From the background information supplied by the inventors, news correspondents obtained the following quote: "The present invention relates to a layered substrate, to a light-emitting diode (hereinafter, referred to as LED) including the layered substrate, and to an electric or electronic device including a motherboard, on which a part of peripheral side surface of the layered substrate of the LED is mounted.
"As a light source, an LED to be mounted on a motherboard, a side surface of the LED to be mounted on the motherboard is conventionally known, for example, in JP2011-91344A and JP2000-12773. JP2011-91344A discloses and LED that includes a frame 10 with a T-shape portion at a side surface that is to be mounted on a motherboard, and JP2000-12773 discloses a layered substrate with a plurality of terminal electrodes provided at a side surface of the layered substrate."
Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "The present invention is proposed in view of such conventional devices as above-described.
"According to embodiments of the present invention, a layered substrate including a first substrate that includes an upper surface, a lower surface, a peripheral surface between peripheral edges of the upper surface and the lower surface, and a cut portion cut into the peripheral surface and passing through the upper surface and the lower surface, a second substrate including an upper surface, a lower surface, and a peripheral surface between peripheral edges of the upper surface and the lower surface, and the lower surface of the second substrate layered on the upper surface of the first substrate and closing the cut portion of the first substrate from above, and the second substrate including a heat conductor that is thermally connected to an element to be mounted on the upper surface of the second substrate, the heat conductor configured to thermally extend to the cut portion of the first substrate.
"The heat conductor may be a metal filled in a hole provided in the second substrate, or maybe a metal plate disposed on the first substrate to cover the cut portion of the first substrate from above. Also, the heat conductor may be at least one strip of thermally conductive sheet that covers the cut portion from above.
"Furthermore, in embodiments, a light-emitting diode includes a layered substrate according to the embodiments of the present invention, the element that is a light-emitting element mounted on the upper surface of the second substrate, and such a light-emitting diode may be mounted on a motherboard of an electric or electronic device to be a light source in such a device."
For the URL and additional information on this patent, see: Sugiura, Miharu;
Keywords for this news article include: Light-emitting Diode,
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