The patent's assignee for patent number 8618656 is
News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a flexible semiconductor package, more particularly, to a flexible semiconductor package apparatus having a responsive bendable conductive wire member and a method of manufacturing the same.
"Recently, semiconductor chips have been developed to store an enormous amount of data and to process enormous amounts of data in a relatively short time period. Furthermore, many modern day semiconductor packages include these types of semiconductor chips.
"Semiconductor packages includes a substrate, a semiconductor chip mounted on the substrate, a connection member for connecting the semiconductor chip and the substrate, and a molding member covering the semiconductor chip to protect the semiconductor chip from an external impact. The molding member covering the semiconductor chip is designed to protect the semiconductor chip from external impacts.
"As the application and uses semiconductor packages become more and more diversified, flexible semiconductor packages, i.e., those that may be bent without damaging their functionality, are likely to become more desirable and thus needed.
"In the flexible semiconductor package, semiconductor chips will still having bonding pads which will have to be mounted on a flexible substrate. The bonding pads of each semiconductor chip will also have to be connected to other bonding pads of other semiconductor chip through conductive wires.
"However, a problem may arise when the flexible semiconductor chip is bent or twisted. In particularly, tensile stresses arise when the conductive wire is bent which ends up compromising the integrity of either the conductive wire itself or the electrical connection between it and its corresponding bonding pad."
As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "Embodiments of the present invention are directed to a flexible semiconductor package that can aid in minimizing the separation problem of the conductive wire away from the bonding pads of the semiconductor chips, when the corresponding flexible semiconductor chip is bent or twisted.
"Also, embodiments of the present invention are directed to a wire bonding apparatus for bonding the conductive wire for use in manufacturing the flexible semiconductor package.
"In one embodiment, a flexible semiconductor package comprises a flexible substrate; a plurality of semiconductor chips which are spaced apart from each other on the flexible substrate, and each semiconductor chip having bonding pads; and a plurality of conductive wires which electrically connect together the semiconductor chips through their respective bonding pads in which each conductive wire has at least one elastic portion.
"The conductive wire of the flexible semiconductor package may also comprise at least two elastic portions. The elastic portion of the present invention is understood to be an electrically conductive member geometrically configured to be flexible by being bendable, extendable, and collapsible. Accordingly, examples of elastic portions are a helical coiled conductive spring and a sinusoidal arranged conductive spring.
"The elastic portion of the flexible semiconductor package may be wound at least twice.
"The conductive wire of the flexible semiconductor package may further comprise an insulation film on the conductive wire.
"The flexible semiconductor package further comprises a flexible material that covers the flexible substrate, the semiconductor chips and the conductive wire.
"The flexible material may include a gel.
"The flexible semiconductor package may further comprise an additional flexible substrate covering the flexible material.
"The elastic portion may have any known shape of design that is resilient to bending and flexing. One preferred configuration of the elastic portion is that has a coil spring shape.
"In another embodiment, a flexible semiconductor package comprises a first flexible substrate; a second flexible substrate opposed to the first flexible substrate; a first semiconductor chip disposed on an upper surface of the first flexible substrate, and which has a first bonding pad; a second semiconductor chip disposed on a lower surface of the second flexible substrate that substantially faces the upper surface of the first flexible substrate, in which the second semiconductor chip has a second bonding pad; a conductive wire which electrically connects together the first and second bonding pads to each other, and has at least one elastic portion; and a flexible filling member which is interposed between the first and second flexible substrates.
"The flexible filling member of the flexible semiconductor package includes a gel.
"The conductive wire of the flexible semiconductor package comprises at least two elastic portions.
"The conductive wire of the flexible semiconductor package comprises an insulation film covering the conductive wire.
"The elastic portion of the flexible semiconductor package has a coil spring shape.
"The first bonding pad of the first semiconductor chip and the second bonding pad of the second bonding pad of the flexible semiconductor package are configured to face with each other.
"The first semiconductor chip and the second semiconductor chips of the flexible semiconductor package are disposed opposite to each other, and the first and second bonding pads are adjacent to each other.
"In yet another embodiment, a wire bonding apparatus comprises a hollow capillary through which a conductive wire passes; a capillary rotating module which comprises a rotational unit having a rotational shaft, a rotational rod coupled to the rotational shaft, and a capillary rotating unit of which one end is hinged to the rotational rod and the other end is coupled to the hollow capillary; and a conveyer unit which comprises an up-down unit moving up/down the capillary rotating module, and a conveyer unit conveying the capillary rotating module.
"The rotational unit includes a motor.
"The capillary rotating unit of the wire bonding apparatus further comprises a guide member that guides the capillary rotating unit so that the capillary rotating unit is rotated while being substantially maintained in a given direction.
"In the present invention, since a part of the conductive wire, which electrically connects the semiconductor chips, is wound in the responsive form such as a coil responsive form, it aids in is preventing the conductive wire from being separated from the semiconductor chips when the flexible substrate on which the semiconductor chips are mounted is bent, expanded or twisted."
For additional information on this patent, see: Oh,
Keywords for this news article include: Electronics,
Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2014, NewsRx LLC
Most Popular Stories
- Dmytro Firtash, Ukrainian Billionaire, Arrested in Vienna
- Obama, Ukraine Discuss Russian Incursion in Crimea
- Obama's Overtime Initiative Praised, Condemned
- Liberty Media Drops Sirius Bid
- Republicans Warn Obama on Immigration
- Uli Hoeness, Bayern Munich President, Gets Prison for Tax Evasion
- Lady Gaga Roasts Self on Spit at SXSW
- West Readies Harsh Sanctions Against Russia
- Calumet Photo Files for Bankruptcy
- Drake Wins Big MTV's Woodie Awards at SXSW