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Researchers Submit Patent Application, "Method for Manufacturing Electronic Component Module and Electronic Component Module", for Approval

February 6, 2014



By a News Reporter-Staff News Editor at Politics & Government Week -- From Washington, D.C., VerticalNews journalists report that a patent application by the inventor KANAE, Masaaki (Nagaokakyo-shi, JP), filed on September 16, 2013, was made available online on January 23, 2014.

The patent's assignee is Murata Manufacturing Co., Ltd.

News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to an electronic component module including an electronic component, such as a SAW (surface acoustic wave) element or a BAW (bulk acoustic wave) element, contained in a resin layer.

"As an electronic component such as an existing SAW (surface acoustic wave) element or BAW (bulk acoustic wave) element, for example, an electronic component described in Japanese Unexamined Patent Application Publication No. 2009-159124 is known. In the electronic component, as shown in FIG. 6, a drive device 112 is provided on a piezoelectric substrate 110. In addition, vibration protection films 116 and 118 are formed around the drive device 112. The vibration protection films 116 and 118 serve to protect the drive device 112.

"Furthermore, a space 138 is formed by a protection device 130. The space 138 is provided so as to ensure a space when an elastic wave or an acoustic wave propagates. The protection device 130 is composed of a first protection film 132, a second protection film 134, and a third protection film 136.

"Meanwhile, when the electronic component in Japanese Unexamined Patent Application Publication No. 2009-159124 is mounted, the space may be collapsed. In other words, when an electronic component module including the electronic component is produced, after the electronic component is mounted on a common substrate, a resin layer is formed so as to cover the electronic component. When the resin layer is formed by means of molding, relatively-high pressure is applied to resin. Thus, depending on the resin, there is a concern that the protection device is deformed and the space is collapsed."

As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "In view of the above-described problems, preferred embodiments of the present invention provide a method for manufacturing an electronic component module and an electronic component module in which a space is prevented from collapsing.

"A method for manufacturing an electronic component module according to a preferred embodiment of the present invention includes a step of preparing an electronic component including an element substrate, a drive device located on a principal surface of the element substrate, and a protection device arranged to define a space around the drive device and covering the drive device; a step of preparing a common substrate, and mounting and fixing the electronic component on the common substrate by using a mounter such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of mounting and fixing a reinforcing plate on the protection device of the electronic component by using a mounter; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.

"In the method for manufacturing the electronic component module according to a preferred embodiment of the present invention, in the step of fixing the reinforcing plate, preferably, an adhesive layer is previously formed on a surface of the reinforcing plate, and the reinforcing plate is fixed such that the adhesive layer is located between the protection device and the reinforcing plate.

"In the method for manufacturing the electronic component module according to a preferred embodiment of the present invention, the reinforcing plate is preferably made of Si.

"In the method for manufacturing the electronic component module according to a preferred embodiment of the present invention, preferably, the element substrate is a piezoelectric substrate and the drive device includes an interdigital transducer electrode.

"In the method for manufacturing the electronic component module according to a preferred embodiment of the present invention, preferably, the element substrate is an insulating substrate and the drive device includes a piezoelectric thin film on both surfaces of which electrodes are formed.

"In the method for manufacturing the electronic component module according to a preferred embodiment of the present invention, preferably, the element substrate is an insulating substrate and the drive device includes a vibrating device made of Si.

"According to another preferred embodiment of the present invention, an electronic component module includes a common substrate; an electronic component fixed on the common substrate, the electronic component including an element substrate, a drive device located on a principal surface of the element substrate, and a protection device arranged to define a space around the drive device and covering the drive device, the electronic component being mounted and fixed by using a mounter such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a reinforcing plate mounted and fixed on the protection device of the electronic component by using a mounter; and a resin layer located on the principal surface of the common substrate so as to contain the electronic component therein.

"In the electronic component module according to a preferred embodiment of the present invention, preferably, an adhesive layer is previously formed on the reinforcing plate and the reinforcing plate is fixed such that the adhesive layer is located between the protection device and the reinforcing plate.

"In various preferred embodiments of the present invention, it is possible to prevent collapse of the space due to the presence of the reinforcing plate.

"The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments with reference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

"FIGS. 1A and 1B are a top view and a cross-sectional view showing an electronic component module according to a preferred embodiment of the present invention.

"FIGS. 2A-2C are cross-sectional views showing a method for manufacturing the electronic component module according to a preferred embodiment of the present invention.

"FIG. 3D is a cross-sectional view showing the method for manufacturing the electronic component module according to a preferred embodiment of the present invention and showing a continuation of FIGS. 2A-2C.

"FIG. 4 is a cross-sectional view showing an electronic component used in a preferred embodiment of the present invention.

"FIG. 5 is a cross-sectional view showing an electronic component used in a preferred embodiment of the present invention.

"FIG. 6 is a cross-sectional view showing an existing electronic component."

For additional information on this patent application, see: KANAE, Masaaki. Method for Manufacturing Electronic Component Module and Electronic Component Module. Filed September 16, 2013 and posted January 23, 2014. Patent URL: http://appft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&u=%2Fnetahtml%2FPTO%2Fsearch-adv.html&r=4774&p=96&f=G&l=50&d=PG01&S1=20140116.PD.&OS=PD/20140116&RS=PD/20140116

Keywords for this news article include: Murata Manufacturing Co. Ltd.

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Source: Politics & Government Week


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