The assignee for this patent application is
Reporters obtained the following quote from the background information supplied by the inventors: "The present invention relates to an integrated circuit device packages in general, and in particular to a method for fabricating solder columns for a column grid array package.
"An integrated circuit (IC) device package may have an IC chip bonded to one side of a substrate and an array of metal connectors extending from the opposite side of the substrate. Two well-known IC device packages are ball grid array (BGA) packages and column grid array (CGA) packages.
"BGA packages utilize an array of solder balls as metal connectors, and are typically employed by relatively low-performance chip applications. On the other hand, CGA packages utilize an array of solder columns as metal connectors. The solder columns of CGA packages have less tin content than the solder balls in BGA packages, which provide a more compliant and flexible pin connection points that can withstand large temperature or mechanical fluctuations. As such, CGA packages are typically employed by relatively high-performance chip applications.
"The present disclosure provides an improved method for fabricating solder columns for CGA packages."
In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "In accordance with a preferred embodiment of the present invention, a column grid array package includes a substrate, an integrated circuit located on a first side of the substrate, and a set of solder columns located on a second side of the substrate. The column grid array package also includes multiple two-tab electronic devices located on the second side of the substrate. The heights of the two-tab electronic devices are substantially identical to the heights of the solder columns.
"All features and advantages of the present invention will become apparent in the following detailed written description.
BRIEF DESCRIPTION OF THE DRAWINGS
"The invention itself, as well as a preferred mode of use, further objects, and advantages thereof, will best be understood by reference to the following detailed description of an illustrative embodiment when read in conjunction with the accompanying drawings, wherein:
"FIG. 1 is a diagram showing a bottom view of a column grid array package, in accordance with a preferred embodiment of the present invention;
"FIG. 2 is a diagram of a side view of the column grid array package from FIG. 1, in accordance with a preferred embodiment of the present invention;
"FIG. 3 is a diagram of a side view of the column grid array package from FIG. 1, in accordance with an alternative embodiment of the present invention; and
"FIG. 4 is a high-level flow diagram of a method for fabricating solder columns for column grid array packages."
For more information, see this patent application: McINTYRE, THOMAS J.; STURCKEN,
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