No assignee for this patent application has been made.
Reporters obtained the following quote from the background information supplied by the inventors: "For purposes of this discussion, an
"The chip module may operate solely in a contactless mode (such as ISO 14443), or may be a dual interface (DIF) module which can operate also in contact mode (such as ISO 7816-2) and a contactless mode. The chip module may harvest energy from an RF signal supplied by an external
"The substrate, which may be referred to as an 'inlay substrate' (for electronic passport) or 'card body' (for smart card) may comprise one or more layers of material such as Polyvinyl Chloride (PVC), Polycarbonate (PC), polyethylene (PE), PET (doped PE), PET-G (derivative of PE), Teslin.TM., Paper or Cotton/Noil, and the like. When 'inlay substrate' is referred to herein, it should be taken to include 'card body', and vice versa, unless explicitly otherwise stated.
"The chip module may be a leadframe-type chip module or an epoxy-glass type chip module. The epoxy-glass module can be metallized on one side (contact side) or on both sides with through-hole plating to facilitate the interconnection with the antenna. When 'chip module' is referred to herein, it should be taken to include 'chip', and vice versa, unless explicitly otherwise stated.
"The antenna may be a self-bonding (or self-adhering) wire. A conventional method of mounting an antenna wire to a substrate is to use a sonotrode (ultrasonic) tool which vibrates, feeds the wire out of a capillary, and embeds it into or sticks it onto the surface of the substrate. A typical pattern for an antenna is generally rectangular, in the form of a flat (planar) coil (spiral) having a number of turns. The two ends of the antenna wire may be connected, such as by thermo-compression (TC) bonding, to terminals (or terminal areas, or contact pads) of the chip module. See, for example U.S. Pat. No. 6,698,089 and U.S. Pat. No. 6,233,818, incorporated by reference herein.
"A problem with any arrangement which incorporates the antenna into the chip module (antenna module) is that the overall antenna area is quite small (such as approximately 15 mm.times.15 mm), in contrast with a more conventional antenna which may be formed by embedding several (such as 4 or 5) turns of wire around a periphery of the of the inlay substrate or card body of the secure document, in which case the overall antenna area may be approximately 80 mm.times.50 mm (approximately 20 times larger). When an antenna is incorporated with the chip module, the resulting entity may be referred to as an 'antenna module'.
"Some State of the Art
"The following patents and publications are incorporated in their entirety by reference herein.
"U.S. Pat. No. 5,084,699 (Trovan, 1992) entitled Impedance Matching Coil Assembly For An Inductively Coupled Transponder. Attention is directed to FIG. 5. A coil assembly for use in an inductively powered transponder includes a primary coil (156) and a secondary coil (158) wrapped around the same coil forming ferrite rod (160). The primary coil's leads (162) are left floating while the secondary coil's leads (164) are connected to the integrated identification circuit of the transponder.
"U.S. Pat. No. 5,955,723 (
"U.S. Pat. No. 6,378,774 (Toppan, 2002) entitled IC Module and
"Toppan's antenna (4) comprises two similar windings (4a, 4b), which are shown in FIG. 17A disposed on opposite sides of a substrate (5), one substantially atop the other. A coupler coil (3) is associated with the card antenna (4). Another coupler coil (8) is associated with the chip module (6). As best viewed in FIGS. 12A and 12B, the two coupler coils (3, 8) are of approximately the same size and are disposed substantially one atop the other.
"U.S. Pat. No. 7,928,918 (
"US 2009/0152362 (
"US2010/0176205 (SPS, 2010) entitled Chip Card With Dual Communication Interface. Attention is directed to FIG. 4. A card body (22) includes a device (18) for concentrating and/or amplifying electromagnetic waves, which can channel the electromagnetic flow received, in particular, from a contactless chip card reader toward the coils of the antenna (13) of the microelectronic module (11). The device (18) for concentrating and/or amplifying electromagnetic waves may consist of a metal sheet disposed in the card body (22) below the cavity (23) receiving the microelectronic module (11), or may consist of an antenna consisting of at least one coil, disposed in the card body (22) below the cavity (23) receiving the microelectronic module (11).
"Refer also to the following: CA 2,279,176; DE 4311493; U.S. Pat. No. 6,142,381; U.S. Pat. No. 6,310,778; U.S. Pat. No. 6,406,935; U.S. Pat. No. 6,719,206; US 2009/0057414; US 2010/0283690; and US 2011/0163167."
In addition to obtaining background information on this patent application, VerticalNews editors also obtained the inventors' summary information for this patent application: "A dual interface (DI) smart card (100) comprising a chip module (CM), a module antenna (MA), a card body (CB) and a card antenna (CA) having two windings (D,E) connected with reverse phase as a 'quasi-dipole'. Capacitive stubs (B,C) connected with an antenna structure (A) of the module antenna (MA). The module antenna (MA) overlaps only one of the windings (D or E) of the card antenna (CA). The card antenna (CA) may be formed from one continuous wire. Ferrite (156) shielding the module antenna (MA) from contact pads (CP) and for enhancing coupling between the module antenna (MA) and the card antenna (CA).
"A dual interface (DIF) smart card comprises a generally rectangular card body CB which may be of multi-layer construction, measuring approximately 50 mm.times.80 mm, a DIF chip module CM measuring approximately 8 mm.times.10 mm, having metallic contact pads (CP) one side of the chip module CM and a module antenna MA on the other side of the chip module CM, and a card antenna CA extending around the periphery of the card body CB and having approximately the same overall size as the card body CB.
"The module antenna MA has a number of turns in a flat spiral pattern, may be rounded, oval or generally rectangular having four side edges, and may be substantially the same overall size as the chip module CM. The module antenna may comprise a wire element wound as a flat coil, or may be etched in a flat coil pattern from a conductive layer on an insulating layer (such as epoxy glass film, or tape).
"The card antenna CA may comprise two windings (or coils)--an outer winding D, and an inner winding E disposed interior of the outer winding D. The inner E and outer D windings are of substantially the same length as each other, each have two ends (or positions) 7, 8, 9, 10 and are connected to have 'reverse phase' as a 'quasi dipole'. For example, the outer end (7) of the outer winding D is connected (or continuous) with the inner end 10 of the inner winding E.
"The card antenna CA may be formed by conventional wire embedding, or using techniques other than wire embedding such as additive or subtractive processes to form conductive tracks and patterns.
"The antenna module AM is disposed so that its module antenna MA overlaps one of the inner E or outer D windings, and not the other. No separate coupling coil is required to couple the module antenna MA with the card antenna CA. Various configurations for the card antenna CA are disclosed, such as the antenna module AM is disposed interior the card antenna CA, and the module antenna MA overlaps only the inner winding E. the antenna module AM may be disposed exterior the card antenna CA with its module antenna MA overlapping only the inner winding E, or interior the card antenna CA with its module antenna MA overlapping on the outer winding D. additional one or more antenna modules AM1, AM2 may be provided and coupled with the card antenna CA to provide additional functionality the card antenna CA may alternatively be formed as a single winding which may require many more turns than the 'quasi dipole' (two windings D, E connected with 'reverse phase')
"To alleviate adverse effects of the metallic contact pads CP on coupling between the module antenna MA and the card antenna CA, a shielding element such as ferrite may be incorporated in the antenna module AM between the module antenna MA and the contact pads CP of the chip module CM.
"The module antenna MA may comprise a 'main' antenna structure A and two additional antenna structures B, C which are capacitive stubs extending from ends of the antenna structure A.
"The antenna module AM may be incorporated in a secure document such as an electronic passport cover, smart card, ID card, or the like.
"According to some embodiments of the invention, a smart card (100) comprises: an antenna module (AM) comprising at least one chip or chip module (CM) and a module antenna (MA); a card body (CB) having at least one surface and a periphery; and a card antenna (CA) extending around the periphery of the card body (CB); characterized in that at least a portion of the module antenna (MA) overlaps at least a portion of the card antenna (CA) for coupling thereto without the intermediary of a coupling coil associated with the card antenna (CA).
"According to some embodiments of the invention, a method of coupling a chip module (CM) having at least a contactless mode to a card antenna (CA) disposed on a card body (CB) of a smart card, comprising providing a module antenna (MA) in an antenna module (AM) with the chip module (CM), characterized by: providing the card antenna (CA) as 'quasi dipole' antenna having two winding portions connected in reverse phase with one another. The card antenna (CA) may have an inner winding (E) and an outer winding (D); and the module antenna (MA) overlaps only one of the inner and outer windings (E, D).
"A pre-laminated array of a special antenna configuration used in the production of contact & contactless transaction cards. In application, the card antenna sandwiched between the outer layers and the printed layers of a smart card, electromagnetically couples with an implanted antenna module AM in the card body CB, achieving a read/write range superior to existing DIF technology. This method of transceiving data is also a major advancement over the unreliable interconnection between a chip card module and an embedded antenna in a card body.
"Secure printers can use their existing smart card milling and chip module implanting systems to produce EMV (Europay,
BRIEF DESCRIPTION OF THE DRAWINGS
"Reference will be made in detail to embodiments of the disclosure, non-limiting examples of which may be illustrated in the accompanying drawing figures (FIGs). The figures are generally diagrams. Some elements in the figures may be exaggerated, others may be omitted, for illustrative clarity. Although the invention is generally described in the context of various exemplary embodiments, it should be understood that it is not intended to limit the invention to these particular embodiments, and individual features of various embodiments may be combined with one another.
"FIGS. 1A, 1B are cross-sectional views of DIF smart cards, according to the invention.
"FIG. 1C is a cross-sectional view of a coil subassembly for an antenna module (AM) of a smart card, according to the invention.
"FIG. 1D is a cross-sectional view of a DIF smart card, according to the invention.
"FIG. 1E is a cross-sectional view of a DI chip module, according to the invention.
"FIG. 2A is a schematic diagram of an antenna module (AM), according to the invention.
"FIG. 2B is a cross-sectional view diagram of the antenna module (AM) of FIG. 2A.
"FIG. 3A is a diagram of a card antenna (CA) for a smart card, according to the invention.
"FIG. 3B is an equivalent circuit diagram of reactive components (capacitances and inductances) associated with the card antenna (CA) of FIG. 3A.
"FIG. 4A is a diagram (plan view) of a configuration of a card antenna CA, according to some embodiments of the invention.
"FIG. 4B is a cross-sectional view of the configuration shown in FIG. 4A.
"FIGS. 4C, 4D, 4E, 4F, 4G, 4H are diagrams (plan view) of configurations of a card antenna CA, according to some embodiments of the invention.
"FIGS. 4I, 4J are cross-sectional views of smart cards with configurations of a card antenna (CA), according to some embodiments of the invention.
"FIGS. 5A, 5B, 5C, 5D, 5E, 5F, 5G, 5H are diagrams (plan view) of various configurations for the card antenna (CA) and various means of interacting with one or more antenna modules AMs, according to some embodiments of the invention.
"FIG. 6A is a cross-sectional view of a technique for applying a mobile phone sticker (MPS) to a cell phone, and FIG. 6B is a cross-sectional view of a shielding element used in the technique for applying a mobile phone sticker (MPS) to a cell phone, according to some embodiments of the invention.
"FIGS. 7A, 7B, 7C, 7D are perspective views of steps involved in a method for making antenna modules (AMs), according to some embodiments of the invention.
"FIG. 7E is a perspective view of a smart card implementing some of the embodiments of the invention disclosed herein. FIG. 7F is a perspective view of a portion of a card body CB with an antenna wire passing through a recess for an antenna module AM.
"FIG. 8 is a diagram (plan view) of a configuration of a card antenna CA, according to some embodiments of the invention."
For more information, see this patent application: Finn, David; Ummenhofer, Klaus. Coupling in and to Rfid Smart Cards. Filed
Keywords for this news article include: Patents, Legal Issues, Electromagnet, Semiconductor, Microelectronics.
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