News Column

Cisco Technology Assigned Patent

January 25, 2014



By Targeted News Service

ALEXANDRIA, Va., Jan. 25 -- Cisco Technology, San Jose, Calif., has been assigned a patent (8,623,707) developed by two co-inventors for a method "of fabricating a semiconductor package with integrated substrate thermal slug." The co-inventors are Andrew V. Kearney, Santa Clara, Calif., and Peng Su, San Jose, Calif.

The patent application was filed on March 26, 2013 (13/850,715). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8623707.PN.&OS=PN/8623707&RS=PN/8623707

Written by Lesley Gonzales; edited by Donabel Harms.

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Source: Targeted News Service


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