The patent's assignee is
News editors obtained the following quote from the background information supplied by the inventors: "The performance of central processors often is critical to the performance of computer information equipments. With advance of semiconductor manufacturing process, these days the clock cycle of the central processors is much faster than the past. On the other hand, the central processors also consume a greater amount of power and generate much more waste heat. If the waste heat is not being properly handled and is accumulated in the central processors, the performances of the central processors are affected and result in not proper functioning.
"To resolve the problem caused by the waste heat, most central processors nowadays are equipped with a cooling means to transfer or disperse heat. In the past the cooling means disperses heat via air cooling through a cooling fan to continuously blow external cooled air to the surface of the central processor. But the air cooling approach cannot effectively dispel heat due to constraints of cooling fan structure and the deployable quantity. Thus liquid cooling using cooling fluid as heat conductive medium has gradually being adopted. Compared with air-cooling heat dissipation, the liquid-cooling heat dissipation can dispel waste heat of the central processor more efficiently.
"A conventional liquid-cooling heat dissipation apparatus mainly includes a pump, a radiator and a heat sink. These elements are distributed in computer information equipments and connected to each other through a plurality of ducts. The ducts are filled with cooling fluid which flows among the elements and absorbs waste heat generated by the central processor through the heat sink, and disperses the waste heat via the radiator. While liquid-cooling heat dissipation provides many advantages over the air cooling heat dissipation, it has to use the cooling fluid as the heat conductive medium and requires multiple sets of ducts to connect various elements. As a result, the internal elements of the computer information equipments cannot be changed or repaired and maintained easily due to the constraints of the ducts.
"To remedy the problems caused by the ducts, some liquid-cooling heat dissipation apparatus with simplified ducts have been developed, such as U.S. Pat. Nos. 7,971,632 and 7,325,591. They disclose a liquid-cooling heat dissipation apparatus that combines a heat sink and a pump to reduce the ducts. The heat sink mainly is designed according to the central processor. The flow speed of the cooling liquid is determined by the pressure provided by the pump that depends on the pump structure, such as the size of impeller. The pump is installed on the heat sink, thus is constrained and cannot be adjusted as required. On the other hand, although the pump mounted onto the heat sink can effectively channel the cooling liquid to dissipate the waste heat via the heat sink, the cooling liquid is driven by the pump to the radiator for cooling before heat exchange of the waste heat is finished. As a result, cooling effect is not as desirable as expected.
"There are also other conventional techniques that combine the pump and radiator. For instance, U.S. Pat. No. 7,527,085 discloses such a technique. While it overcomes the problem resulted from the ducts, it installs the pump on a corner of the radiator, thus most of the pump would extend outside the radiator that results in a bigger size after installation. As miniaturization is the prevailing trend of the computer information equipments now, the aforesaid conventional structure does meet the present requirement."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventor's summary information for this patent application: "The primary object of the present invention is to solve the problem of the conventional liquid-cooling heat dissipation apparatus that results in difficulty for changing or repairing and maintenance of internal elements of computer information equipments.
"Another object of the invention is to reduce space needed for installation of the liquid-cooling heat dissipation apparatus.
"To achieve the foregoing objects, the present invention provides a liquid-cooling heat dissipation apparatus for electronic elements. It comprises an air fan and a liquid-cooling heat dissipation module. The air fan includes a frame and a vane installed on the frame to provide cooling airflow. The liquid-cooling heat dissipation module includes a liquid delivery duct, a liquid return duct, a heat collection element connected to the liquid delivery duct and liquid return duct and coupled with an electronic element to absorb heat, a heat dissipation element to receive the heat from the heat collection element through the liquid return duct and receive the cooling airflow to lower the heat, and a liquid delivery element to provide kinetic energy to drive circulation of the heat from the liquid return duct to the liquid delivery duct. The heat dissipation element and liquid delivery element form a housing space between them to hold the vane of the air fan.
"In one embodiment the liquid delivery element is installed on one side of the air fan opposing to the heat dissipation element and formed at a diameter smaller than that of the vane. The liquid delivery element is preferably located in the center of the vane.
"In another embodiment the liquid delivery element is installed on one side of the air fan via the liquid delivery duct and liquid return duct that serve as support racks. The frame of the air fan is fastened to the heat dissipation element through fastening elements and interposed between the heat dissipation element and liquid delivery element.
"In yet another embodiment the frame of the air fan is extended to form a housing portion between the frame and the vane to hold the liquid delivery element. The vane and liquid delivery element have a same drive bearing. The frame of the air fan is fastened to the heat dissipation element through fastening elements.
"In yet another embodiment the frame of the air fan is extended to form a housing portion on one side opposing the vane to hold the liquid delivery element. The vane and liquid delivery element have a same drive bearing. The frame of the air fan is fastened to the heat dissipation element through fastening elements.
"By means of the construction set forth above, compared with the conventional liquid-cooling heat dissipation apparatus, the invention provides features as follow:
"1. Resolve the problem of difficult replacement or repair and maintenance of the internal elements in the computer information equipment due to the ducts. The invention has the air fan installed between the liquid delivery element and heat dissipation element without installing longer ducts between them, hence the internal elements of the computer information equipment are not constrained by the ducts anymore, and replacement or repair and maintenance of the internal elements in the computer information equipment are simpler.
"2. Smaller installation space. The invention couples the air fan and liquid delivery element in such a way that can save extra location and space needed for installation of the pump.
"The foregoing, as well as additional objects, features and advantages of the invention will be more readily apparent from the following detailed description, which proceeds with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
"FIG. 1 is a perspective view of an embodiment of the liquid-cooling heat dissipation apparatus for electronic elements of the invention.
"FIG. 2 is an exploded view of an embodiment of the liquid-cooling heat dissipation apparatus for electronic elements of the invention.
"FIG. 3 is an exploded view of the air fan and pump according to an embodiment of the invention.
"FIG. 4 is a sectional view of the heat dissipation element according to an embodiment of the invention.
"FIG. 5 is a schematic view of cooling fluid flow according to an embodiment of the invention.
"FIG. 6 is a schematic view of installation of the air fan and liquid delivery element according to another embodiment of the invention.
"FIG. 7 is an exploded view of the air fan and liquid delivery element according to another embodiment of the invention.
"FIG. 8 is a schematic view of yet another embodiment of the invention with multiple sets of the liquid-cooling heat dissipation apparatus."
For additional information on this patent application, see:
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