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Patent Issued for Semiconductor Multichip Module Package with Improved Thermal Performance; Reduced Size and Improved Moisture Resistance

January 29, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- International Rectifier Corporation (El Segundo, CA) has been issued patent number 8629566, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventors are Shivkumar, Bharat (Redondo Beach, CA); Cheah, Chuan (Redondo Beach, CA).

This patent was filed on September 26, 2005 and was published online on January 14, 2014.

From the background information supplied by the inventors, news correspondents obtained the following quote: "Multichip semiconductor modules ('MCMs') are known and generally consist of a plurality of interconnected semiconductor die mounted on a substrate to form small power conditioning circuits such as d-c to d-c converters, power supplies for portable electronic equipment and the like.

"It is very desirable in such devices to minimize electrical resistance due to packaging (die free package resistance or DFPR); to maximize chip foot print ratios; to improve the thermal resistance R.sub.th of the package; and to improve package reliability and manufacturability."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventors' summary information for this patent: "In accordance with the invention; a number of novel package innovations, which can be used separately or in combination are provided.

"Thus, a 'liquid metal' mold cap (a conductive metal-filled epoxy, for example) is provided with vertical insulation barriers separating the top contacts of selected chips while still improving DFPR. The conductive, or liquid metal electrode may be cast with fins to improve cooling.

"The chip-foot print ratio is maximized by 'tomb-stoning' (or erecting vertically) elongated passive components and by stacking die atop one another.

"Thermal resistance is improved by forming fin structures in the top conductive contact, or in an insulation mold cap. Tall passives on the substrate are preferably moved to the center of the substrate and between finned areas.

"Reliability and manufacturability is substantially improved by using mold locks to lock the insulation cap onto and telescoping over an organic substrate which receives semiconductor die.

"Other features and advantages of the present invention will become apparent from the following description of the invention which refers to the accompanying drawings."

For the URL and additional information on this patent, see: Shivkumar, Bharat; Cheah, Chuan. Semiconductor Multichip Module Package with Improved Thermal Performance; Reduced Size and Improved Moisture Resistance. U.S. Patent Number 8629566, filed September 26, 2005, and published online on January 14, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=48&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=2359&f=G&l=50&co1=AND&d=PTXT&s1=20140114.PD.&OS=ISD/20140114&RS=ISD/20140114

Keywords for this news article include: Electronics, Semiconductor, International Rectifier Corporation.

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Source: Electronics Newsweekly


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