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Patent Issued for High Performance On-Chip Vertical Coaxial Cable, Method of Manufacture and Design Structure

January 29, 2014



By a News Reporter-Staff News Editor at Electronics Newsweekly -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Mina, Essam (South Burlington, VT); Wang, Guoan (South Burlington, VT); Woods, Jr., Wayne Harvey (Burlington, VT), filed on February 1, 2011, was published online on January 14, 2014.

The patent's assignee for patent number 8629536 is International Business Machines Corporation (Armonk, NY).

News editors obtained the following quote from the background information supplied by the inventors: "Field of the Invention

"The present invention relates to the field of coaxial cables, and more particularly, to a high performance on-chip vertical coaxial cable, method of manufacturing the same and design structure thereof.

"A coaxial cable is an electrical cable generally applied as a high-frequency transmission line to carry a high frequency or broadband signal. The coaxial cable can be used for connecting radio transmitters and receivers with their antennas, Internet connections, and for distributing cable television signals, among other applications. Sometimes, DC power (called a bias) is added to the signal to supply the equipment at the other end, as in direct broadcast satellite receivers, with operating power. One advantage of the coaxial cable over other types of transmission line is that ideally the electromagnetic field carrying the signal exists only in the space between the inner and outer conductors, so the coaxial cable cannot interfere with or suffer interference from external electromagnetic fields. Another area which could utilize coaxial cables is integrated circuit technology. On-chip coaxial cable is advantageous in connecting integrated circuits to reduce the noise and crosstalk.

"Conventional on-chip coaxial cable is built within metal layers of a semiconductor chip and is typically arranged along a horizontal plane, as shown in FIG. 1. However, this design has several disadvantages associated with it. One disadvantage involves the distance between an outside shielding conductor and a signal line. More specifically, in a conventional on-chip coaxial cable structure, since this structure is typically formed within metal layers and positioned along a horizontal plane, the distance between the outside conductor and the signal line is not substantially uniform and is limited by the available metal technologies in the semiconductor chip. Additionally, this prior art design limits the shape of the coaxial cable structure to a rectangular prism or a cube.

"Accordingly, there exists a need in the art to overcome the deficiencies and limitations described hereinabove."

As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "In an aspect of the invention, a coaxial cable structure comprises an inner conductor and an insulating material that coaxially surrounds the inner conductor. The structure further comprises an outer conductor which surrounds the insulating material. Both the inner and outer conductors are comprised of a plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by conductors. The coaxial cable structure is formed upon a surface of a semiconductor substrate and is oriented in substantially perpendicular alignment with the surface.

"In another aspect of the invention, a method for fabricating a coaxial cable structure comprises forming a first shape of an inner conductor in a plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by a first conductor and forming a second shape of an outer conductor in the plurality of metal layers formed on different wiring levels and interconnected between the different wiring levels by a second conductor. The coaxial cable structure is formed upon a surface of a semiconductor substrate and is oriented in substantially perpendicular alignment with the surface.

"In another aspect of the invention, a design structure embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit is provided. The design structure comprises the structures and/or methods of the present invention.

"A more complete understanding of the present invention, as well as further features and advantages of the present invention, will be obtained by reference to the following detailed description and drawings. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only, and should not be considered restrictive of the scope of the invention, as described and claimed. Further, features or variations may be provided in addition to those set forth herein. For example, embodiments of the invention may be directed to various combinations and sub-combinations of the features described in the detailed description."

For additional information on this patent, see: Mina, Essam; Wang, Guoan; Woods, Jr., Wayne Harvey. High Performance On-Chip Vertical Coaxial Cable, Method of Manufacture and Design Structure. U.S. Patent Number 8629536, filed February 1, 2011, and published online on January 14, 2014. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=48&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=2389&f=G&l=50&co1=AND&d=PTXT&s1=20140114.PD.&OS=ISD/20140114&RS=ISD/20140114

Keywords for this news article include: Electronics, Electromagnet, Semiconductor, International Business Machines Corporation.

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Source: Electronics Newsweekly


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