By a News Reporter-Staff News Editor at Journal of Technology -- Data detailed on Friction, Lubrification and Wear have been presented. According to news reporting originating from Edmonton, Canada, by VerticalNews correspondents, research stated, "Chemical mechanical polishing (CMP) is a widely used nanofabrication technique that allows precise abrasion of surfaces under controlled chemical conditions. This precision also makes CMP an ideal method to investigate the complex and interrelated phenomena that control simultaneous abrasion and passivation processes."
Our news editors obtained a quote from the research from the University of Alberta, "In this paper, the controlled wear of copper by CMP is shown to be due to the synergistic interaction of passivation and mechanical abrasion. The overall rate at which copper is removed depends on the relative rates of the mutually dependent passivation and abrasion processes, and a synergistic interaction parameter Delta RC-A. A peak in the copper removal rate is observed when Delta RC-A is highest, and the abrasion and passivation rates balance each other; away from this peak, the removal rate is dominated by either the passivation or abrasion rate. While the interaction of abrasion and corrosion processes in CMP has been examined by a number of workers, this paper quantifies for the first time the magnitude of synergism for a model peroxide-glycine-citric acid-silica system. As well as affecting overall removal rate, the relative passivation and abrasion rates determine the final wafer surface quality. Where abrasion dominates, the surface roughness is high. Conversely, the protection offered to the underlying film by a strongly passivating chemistry results in very low surface roughness, a highly desirable outcome in copper CMP."
According to the news editors, the research concluded: "Minimizing slurry cost and maximizing final surface quality are two key objectives of the CMP process; the approach presented in this paper allows these two objectives to be simultaneously met."
For more information on this research see: Chemically enhanced synergistic wear: A copper chemical mechanical polishing case study. Wear, 2013;307(1-2):155-163. Wear can be contacted at: Elsevier Science Sa, PO Box 564, 1001 Lausanne, Switzerland. (Elsevier - www.elsevier.com; Wear - www.elsevier.com/wps/product/cws_home/504107)
The news editors report that additional information may be obtained by contacting L.M. Nolan, University of Alberta, Dept. of Chem & Mat Engn, Edmonton, AB T6G 2V4, Canada.
Keywords for this news article include: Edmonton, Alberta, Canada, North and Central America, Friction, Lubrification and Wear
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