Contract notice: System for thermal laser separation.
System for thermal laser separation as follows The specific system must be usable for cutting silicon wafers in photovoltaic and semiconductor technology. The system must operate according to the principle of the separation material lossless thermal Laserseparierung (material separation by rapid cooling by laser-induced heating). It should be possible to upgrade the system at a later date with alternative laser heads or heads structuring alternative to mechanical structuring.
Time limit for receipt of requests for documents or for accessing documents:
Language(s) in which tenders or requests to participate may be drawn up:
Tender documents : T18492939.html
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