Next-generation integrated devices for matching, filtering and protection help shrink circuit size and boost end-product performance.
ST leverages advanced semiconductor technologies to integrate commonly used circuit elements such as passive filters, ESD suppressors and wireless baluns in a much smaller size than state-of-the-art discrete solutions. As semiconductor devices, ST s components also display tighter tolerances and higher stability than conventional discrete components, allowing product designers to miniaturize pc-board size, accelerate time-to-market and improve quality.
The latest advanced devices joining ST s micro-package families include the world s smallest single-line Transient-Voltage Suppressor, the ESDAVLC6-1BV2, in a 01005 surface-mount package to protect sensitive circuitry against hazardous voltage surges. ST is also introducing the first five members of its new ECMF family of common-mode filters embedding ESD protection. These are built using advanced silicon technology and are offered in ultra-thin packages only 0.55mm high.
Another new member of ST s IPD (Integrated Passive Device) family, the BAL-NRF01D3 ultra-miniature wireless balun, has already enabled ST s customers to boost the performance of their low-power wireless solutions and save up to 90% of the pc-board space occupied by discrete antenna-matching and harmonic-filtering components.
Background to ST s Integrated Passives and Protection Devices
ST s technologies leverage advanced component-fabrication technologies to combine into a single device multiple circuit elements including resistors, capacitors, inductors and ESD diodes that are otherwise typically implemented as individual components on the pc-board. In this way, ST s integrated devices eliminate multiple components and the interconnections between them, resulting in a large net saving in pc-board area. Hence designers can use them to create smaller end-products, increase functionality by designing-in extra ICs, simplify PCB layout and shorten time-to-market for new products.
Moreover, ST s integrated devices deliver better performance than equivalent discrete devices, as they are produced using semiconductor processes that display greater quality, reliability and process control.
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