-Invensas Corp., a provider of semiconductor technology solutions and subsidiary of Tessera Technologies, Inc., announced that it received the Frost & Sullivan 2013 North American Customer Value Enhancement Award in 3D Packaging and 3D IC Market for Mobile Computing for its Bond Via Array (BVA) mobile technology.
Complete details of the award description and ceremony can be found on invensas.com. The Customer Value Enhancement Award recognizes Invensas for its outstanding accomplishments in Mobile Computing. To quote Frost & Sullivan, "the mobile market constantly needs more bandwidth for the smartphone mania. With the Gen Y generation wanting to run almost all aspects of their lives through smartphones and apps, the demand for speed and bandwidth is increasing. Another cause for concern is power consumption as processing so many apps on a phone drains its battery and reduces its life. Invensas' BVA technology provides mobile and smartphone manufacturers with a cost-effective, reliable, and ready-to-use solution that addresses their bandwidth and power consumption needs today."
"We are delighted to be recognized by Frost & Sullivan and to receive such a strong external validation of our BVA platform through interviews with our customers and competitors," said Simon McElrea, president, Invensas.
Frost & Sullivan's global research organization comprises 1,800 analysts and consultants who monitor more than 300 industries and 250,000 companies. The company's research philosophy originates with the CEO's 360-Degree Perspective, which serves as the foundation of its TEAM Research methodology.
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