By Targeted News Service
ALEXANDRIA, Va., Sept. 20 -- Energy Related Devices, Tucumcari, N.M., has been assigned a patent (8,537,554) developed by Robert G. Hockaday, Los Alamos, N.M., for a "structured relief dielectric heat sink for planar photovoltaic cells and semiconductor devices."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "Distribution and coupling of waste heat from planar non-concentration photovoltaic cells and semiconductor electrical devices is enhanced by forming dielectric relief structures and thermal conductive and emissive coatings on the cover and/or backing plate. The composite relief structures of layers, voids, and fins on the back surface mitigate the differential thermal expansion of dissimilar material and optimize convective heat transfer and radiant heat transfer with respect to costs. This leads to higher performance of the photovoltaic and semiconductor cells, a stronger and lighter backing plate components, and lower cost per watt for mounted devices."
The patent application was filed on May 17, 2010 (12/800,537). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8537554.PN.&OS=PN/8537554&RS=PN/8537554
Written by Kusum Sangma; edited by Anand Kumar.