Editors' Note: There is a photo associated with this press release.
The ZOPT3100 integrates an ambient light sensor (ALS), a color sensor (CS), and a proximity sensor (PS), as well as an integrated
A wide supply voltage range of 2.4 to 3.6V combined with a low supply current of 200uA (excluding the LED driver) and a configurable standby mode allow use in mobile battery-driven applications.
The ZOPT3100 delivers extremely high sensitivity especially in low-lux areas, making it optimal for usage behind very dark cover glasses, and it maintains superior linearity across the temperature range to ensure consistent results under different conditions. For display light adjustment, the IC is balanced to achieve an excellent fit to the human eye's characteristics. The best-in-class IR-suppression (greater than 650nm) together with a proximity sensor offering the best sensitivity available in the market enables precise object detection that is ideal for usage in mobile devices.
Modern products including mobile phones, tablet computers, notebooks, cameras, PC monitors and gaming devices can greatly benefit from the ZOPT3100's performance.
"Energy-efficiency and precision are what we do best. We designed the ZOPT3100 to provide our customers with the required resolution and accuracy for their next generation products," said
Features of the ZOPT3100:
-- Multiple optical sensor channels on one chip -- Parallel measurement of proximity, ambient light and color -- Outstanding crosstalk immunity for proximity measurements -- Ambient light dynamic range: 0.006 to 32,000 lux -- High color sensing channel resolution: 18 bits -- Wide operating temperature range:-40 degrees C to +90 degrees C -- Broad power supply range: 2.4 to 3.6 V -- Overall current consumption as low as 200uA (LED driver excluded) -- Standby mode current: less than 2uA -- Internal temperature compensation -- I2C(TM) interface (I2C(TM) is a trademark of NXP) -- Programmable interrupt functions Availability and Pricing
The ZOPT3100 is in full production and is available as die for wafer bonding. Die, samples wafers and an application kit are available from ZMDI.
For 15,000 pieces, the ZOPT3100 is priced at
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FOR FURTHER INFORMATION PLEASE CONTACT:
Daniel AitkenZMDI Global Director of Corporate Marketing and CommunicationsT +001 438 288 3668 email@example.com Source: Zentrum Mikroelektronik Dresden AG(ZMDI)