By Targeted News Service
ALEXANDRIA, Va., Sept. 13 -- Raytheon, Waltham, Mass., has been assigned a patent (8,531,821) developed by Eli Holzman, Thousand Oaks, Calif., Paul Brian Hafeli, Ventura, Calif., and Robert Michael Sterns, Lompoc, Calif., for a "system for securing a semiconductor device to a printed circuit board."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "In accordance with the teaching of the present invention, a system and method for securing a ball grid array to a printed wire board is provided. In a particular embodiment, a ball grid array comprises one or more balls configured to attach to a spring comprising one or more turns. In addition, there is a spacer plate configured to align and separate the springs, a soldering aid configured to align solder on the printed wire board and a printed wire board configured with conductive pads to attach to the ball grid array via the springs."
The patent application was filed on Jan. 28, 2011 (13/016,701). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,531,821.PN.&OS=PN/8,531,821&RS=PN/8,531,821
Written by Kusum Sangma; edited by Anand Kumar.