By Targeted News Service
ALEXANDRIA, Va., Sept. 13 -- Qualcomm, San Diego, has been assigned a patent (8,531,806) developed by four co-inventors for a "distributed building blocks of R-C clamping circuitry in semiconductor die core area." The co-inventors are Reza Jalilizeinali, San Diego, Evan Siansuri, San Diego, Sreeker R. Dundigal, San Diego, and Eugene R. Worley, San Diego.
The abstract of the patent published by the U.S. Patent and Trademark Office states: "A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at least one capacitor block in the core area. The RC clamping circuitry also includes chip level conductive layer connections between each of the distributed building blocks."
The patent application was filed on June 30, 2011 (13/173,977). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,531,806.PN.&OS=PN/8,531,806&RS=PN/8,531,806
Written by Kusum Sangma; edited by Anand Kumar.