News Column

Intel CEO Krzanich Outlines Product Plans

September 13, 2013

Global Data Point

intel

From datacenters to ultra-mobile devices such as tablets, phones and wearables, computing segments are undergoing exciting and even game-changing transitions, said new Intel CEO Brian Krzanich during the opening session of the Intel Developer Forum on September 10. Krzanich laid out Intel's vision and described how Intel is addressing each dynamic market segment - such as accelerating Intel's progress in ultra-mobile devices - with new products over the next year and beyond, including a new, lower-power product family.

Krzanich said that Intel this week will introduce Bay Trail, Intel's first 22nm system-on-a-chip (SoC) for mobile devices. The Bay Trail is based on the company's new low-power, high-performance Silvermont microarchitecture, which will power a range of Android and Windows designs, most notably tablets and 2-in-1 devices.

As an example of how Intel will continue to use its manufacturing and architectural leadership to push further into lower power regimes, Krzanich announced the Intel Quark processor family. The new lower-power products will extend Intel's reach to growing segments from the industrial Internet-of-Things to wearable computing. It is designed for applications where lower power and size take priority over higher performance.

Intel will sample form-factor reference boards based on the first product in this family during the fourth quarter of this year to help partners accelerate development of tailored, optimized solutions initially aimed at the industrial, energy and transportation segments.

As the next era of computing grows even more personal, wearables are a hotbed for innovation. Krzanich highlighted a bracelet as an example of a concept with reference designs under development, and said the company is actively pursuing opportunities with partners in this area.

In high-speed 4G wireless data communications, Krzanich said Intel's new LTE solution provides a compelling alternative for multimode, multiband 4G connectivity, removing a critical barrier to Intel's progress in the smartphone market segment. Intel is now shipping a multimode chip, the Intel XMM 7160 modem, which is one of the world's smallest and lowest-power multimode-multiband solutions for global LTE roaming.

As an example of the accelerating development pace under Intel's new management team, Krzanich said that the company's next-generation LTE product, the Intel XMM 7260 modem, is now under development. Expected to ship in 2014, the Intel XMM 7260 modem will deliver LTE-Advanced features, such as carrier aggregation, timed with future advanced 4G network deployments. Krzanich showed the carrier aggregation feature of the Intel XMM 7260 modem successfully doubling throughput speeds during his keynote presentation.

He also demonstrated a smartphone platform featuring both the Intel XMM 7160 LTE solution and Intel's next-generation Intel Atom SoC for 2014 smartphones and tablets codenamed Merrifield. Based on the Silvermont microarchitecture, Merrifield will deliver increased performance, power-efficiency and battery life over Intel's current-generation offering.

Citing continued, rapid innovation for PCs of the future, Krzanich demonstrated a 14nm-based Broadwell system. Broadwell, set to begin production by the end of this year, will be the lead product made using Intel's 14nm manufacturing process. The first Broadwell products will deliver higher performance, longer battery life and low platform power points for 2-in-1 and fanless devices, ultrabooks and various PC designs.

Saying that Intel will bring the full weight of its manufacturing process and architectural leadership to the Intel Atom processor family, he confirmed Intel intends to bring its Intel Atom processor and other products based on the next-generation Airmont microarchitecture to market on Intel's 14nm process technology beginning next year. Timing will vary by product segment.

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Original headline: New Intel CEO outlines company product plans


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Source: (c) 2013 Global Data Point. All Rights Reserved.


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