Patent application serial number 409095 has not been assigned to a company or institution.
The following quote was obtained by the news editors from the background information supplied by the inventors: "The present invention relates to an illumination device, and more particularly to a multi-layer array type LED device having a multi-layer heat dissipation structure which has an excellent heat dissipation performance.
"With the breakthrough of light emitting diode (LED) technology, the illumination brightness and the illumination efficiency are greatly increased, and thereby LED gradually becomes the new illumination component for replacing conventional lamp bulb, and thereby LED is widely used in a vehicle illumination device, a hand-held illumination device, a backlight source for liquid crystal display device, a traffic sign lamp or an indication billboard.
"FIG. 1 is a schematic view showing a structure of a conventional LED. As shown in FIG. 1, a conventional LED 1a includes at least one LED chip 11a, a substrate 12a and a package body 13a, wherein the LED chip 11a is disposed on the substrate 12a and connected with the substrate 12a. The package body 13a is used for packaging the LED chip 11a and the substrate 12a, and such a LED can emit certain color light. The LED 1a is driven and controlled by an external drive circuit 2a. The LED has to be connected to the substrate 3a of the external drive circuit 2a when it is operated. However, when the LED is driven and controlled by the external drive circuit, the heat generation becomes a problem. Therefore, the heat generation problem must be solved in order to increase the illumination efficiency. There were two different conventional methods for solving the issue of heat generation, and one method is based on an internal heat dissipation mechanism installed inside of the LED, and another method is based on an external auxiliary heat dissipation mechanism installed outside of the LED. In the internal heat dissipation mechanism of LED, a heat conductive unit is installed in the LED module for allowing heat generated by the LED chip to be transferred to the exterior of the LED module. In the external auxiliary heat dissipation mechanism, a heat dissipator or a fan is installed for dissipating heat generated by the LED chip.
"The internal heat dissipation mechanism and/or the external auxiliary heat dissipation mechanism can be utilized by the conventional LEDs for dissipating heat generated by the LED chip, but these heat dissipation mechanisms have their limitations for dissipating heat so that the temperature of the LED module cannot be effectively lowered, which cause the decrease of the illumination efficiency of LED and the increase of the cost for heat dissipation. Furthermore, when the external heat dissipation mechanism is utilized by the LED for dissipating heat, the arrangements and the connection between the LED and the substrate of the external drive circuit will become an issue to be solved.
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