No assignee for patent application serial number 770153 has been made.
News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to an ultrasonic transducer device that has a substrate in which openings are provided in an array pattern and an ultrasonic transducer element provided in each opening, a probe that uses the ultrasonic transducer device, and an electronic instrument and an ultrasonic diagnostic device that use the probe.
"As disclosed in Japanese Laid-Open Patent Publication No. 2011-82624, for example, an ultrasonic transducer element chip is provided with a substrate. A plurality of openings are formed in the substrate. An ultrasonic transducer element is provided in each of the openings.
"Japanese Laid-Open Patent Publication No. 2011-56258 discloses a bulk-type ultrasonic transducer element. In the bulk-type ultrasonic transducer element, no opening is formed in a substrate, and the plate thickness of the substrate can be thick. Therefore, the strength of the substrate can be sufficiently obtained. An integrated circuit can be formed on the substrate."
As a supplement to the background information on this patent application, VerticalNews correspondents also obtained the inventors' summary information for this patent application: "As described above, when a plurality of openings are formed in a substrate to construct an ultrasonic transducer element chip, the strength of the substrate will be deteriorated. In particular, since an etching process is used for forming an opening, it is preferable that the thickness of a substrate be reduced. When the thickness of a substrate is made thin, however, the strength of the substrate will further be deteriorated. Forming an integrated circuit on such a substrate has not yet been proposed.
"According to at least one aspect of the present invention, an ultrasonic transducer element chip whose thickness is securely reduced to connect an integrated circuit can be provided.
"An ultrasonic transducer device according to one aspect of the present invention a substrate, a plurality of ultrasonic transducer elements, a wiring substrate and a wiring member. The substrate defines a plurality of openings arranged in an array pattern. Each of the ultrasonic transducer elements is provided in each of the openings on a first surface of the substrate. The wiring substrate is arranged to face a second surface of the substrate that is opposite from the first surface. The wiring substrate includes a first wiring part. The wiring member is connected to the substrate and the wiring substrate. The wiring member includes a second wiring part electrically connecting the ultrasonic transducer elements to the first wiring part.
"With this configuration, the second wiring can be disposed outside the substrate and the wiring substrate. A connecting terminal does not need to be provided between the substrate and the wiring substrate. As a result, the substrate can be overlapped on the wiring substrate. The distance between the substrate and the wiring substrate can be reduced as much as possible. Therefore, the thicknesses of the substrate and the wiring substrate can be reduced to connect an integrated circuit. Further, when the substrate is overlapped on the wiring substrate, the strength of the substrate can be increased. The thickness of the substrate can be securely reduced. In this manner, thickness reduction can be achieved in the ultrasonic transducer device.
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