The assignee for this patent, patent number 8526822, is
Reporters obtained the following quote from the background information supplied by the inventors: "Known optical transceivers components are comprised of a fiber optic transmitter die, a fiber optic receiver die, a trans-impedance amplifier die, and a transmitter driver die. Each of the fiber optic transmitter and fiber optic receiver die are mounted on separate flexible circuit assemblies. The trans-impedance amplifier die and the transmitter driver die are mounted together on a separate assembly and are maintained in a fixed location, usually on the circuit board. The trans-impedance amplifier die and the transmitter driver die are high power devices and generate a large amount of heat. It has been found that placing these components in close proximity to the fiber optic transmitter die and the fiber optic receiver die results in degraded performance of the die."
In addition to obtaining background information on this patent, VerticalNews editors also obtained the inventors' summary information for this patent: "A flexible circuit assembly is described that integrates a first fiber optic die, a second fiber optic die, a trans-impedance amplifier die and a transmitter driver die on a single flexible circuit. A heat sink is provided that transfers heat from the trans-impedance amplifier die and the transmitter driver die and isolates the fiber optic die from the heat sources.
"The flexible circuit assembly is used in an optical transceiver component as shown in FIG. 1. Integration of the first fiber optic die, second fiber optic die, trans-impedance amplifier die and transmitter driver die into a single flexible circuit assembly allows for the miniaturization of optical assemblies used in an optical transceiver component. The reduction in size of the optical assemblies within a transceiver component will improve manufacturability and cost. In addition, transceiver reliability and maintainability will improve. There will also be data rate frequency performance improvements due to the improved proximity and interconnection of the first fiber optic die to the transmitter driver and the second fiber optic die to the trans-impedance amplifier.
"The integration of a heat sink allows for the close proximity of the driver and amplifier to the fiber optic die. The heat sink is thermally connected to the driver and amplifier as part of the flexible circuit assembly and the heat sink is in contact with the optical transceiver frame in order to further dissipate the heat away from the fiber optic die.
"In one example, a fiber optic transmitter die, a fiber optic receiver die, a trans-impedance amplifier die and a transmitter driver die are integrated into one flexible circuit assembly and are disposed on a first major surface of the flexible circuit. A heat sink is integrated with the flexible circuit assembly. An electrical connection is provided between the fiber optic transmitter die and the transmitter driver and between the fiber optic receiver die and the trans-impedance amplifier. Circuitry is also provided from the trans-impedance amplifier die and the transmitter driver die to the second end of the flexible circuit. The circuitry is connected to the flexible circuit.
"In addition, the fiber optic die each contain grounding circuitry and the grounding circuitry of the fiber optic die is isolated from the each other. The trans-impedance amplifier die and the transmitter driver die also each contain grounding circuitry and the grounding circuitry of the trans-impedance amplifier die is isolated from the grounding circuitry of the transmitter driver die."
For more information, see this patent: Karnopp, Roger J.; Thorson, Kevin J.; Drexler, Gregory M..
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