The patent's assignee for patent number 8525329 is
News editors obtained the following quote from the background information supplied by the inventors: "A multi-component electronic package or module for integrated circuits typically includes one or more integrated circuit devices and discrete passive and active components. For example, the integrated circuit devices can be in the form of integrated circuit dice which include terminals that contact conductive pads of the package circuits using bonding wires, solder flip-chip attach, or other structures. The discrete components can include passive devices such as resistors, capacitors, and inductors, as well as active components such as memory devices, crystals (e.g., for clock signals), radios, or other devices. The discrete components are included in the same package as the integrated circuit die or dice to provide a multi-function module, or in some cases a complete system in a package (SIP).
"In some integrated circuit packages, multiple dice are included. In a typical configuration, the first die is attached to the package substrate, e.g., using epoxy polymer as adhesive and wirebonding for electrical connections, or, alternatively using flip-chip technology to contact the substrate. Additional dice, of similar or dissimilar size, are stacked on top of the first die and on top of each other to increase the packing density of the package.
"The discrete components of the integrated circuit package, however, are positioned along the sides of the dice and are attached to conductive pads. The positioning of the discrete components around the perimeter of the dice leads to wider and longer packages. Thus, packing density is overall decreased, and the packages use a large amount of area to house the discrete components. Furthermore, additional contact pads must be added on the substrate around the die so that the discrete components may be electrically attached to the package circuits.
"Accordingly, what is needed is a method and system for reducing the package density of integrated circuit packages that include discrete components. The present invention addresses such a need."
As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventor's summary information for this patent: "The invention of the present application relates to stacking components to increase packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a component layer parallel to and aligned with a surface area of the substrate. An integrated circuit die is positioned adjacent to the component layer such that a face of the integrated circuit die is substantially parallel to the surface area of the substrate. The face of the integrated circuit die is aligned with at least a portion of the component layer, and terminals of the integrated circuit die are connected to the substrate.
"In another aspect of the invention, a method for forming an integrated circuit package includes placing a plurality of discrete components on a surface area of a substrate to approximately form a component layer parallel to the surface area of the substrate. An integrated circuit die is placed on the component layer such that a face of the integrated circuit die is substantially parallel to the surface area of the substrate, and the face of the integrated circuit die is aligned with at least a portion of the component layer. Terminals of the integrated circuit die are connected to the substrate.
"In another aspect of the invention, an integrated circuit package includes a substrate; a plurality of discrete components connected to a surface of the substrate, and an integrated circuit die positioned over at least a portion of the discrete components, where terminals of the integrated circuit die are connected to the substrate.
"The present invention provides a packing configuration that increases the packing density of an integrated circuit electronics package. By placing an integrated circuit die over or adjacent to a discrete component layer in the package, surface area of the package is saved, allowing smaller integrated circuit packages to be produced."
For additional information on this patent, see: Lam, Ken M.. Component Stacking for Integrated Circuit Electronic Package. U.S. Patent Number 8525329, filed
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