By Targeted News Service
ALEXANDRIA, Va., Aug. 26 -- Intel, Santa Clara, Calif., has been assigned a patent (8,513,108) developed by Jiamiao Tang, Shanghai, China, Henry Xu, Shanghai, China, and Shinichi Sakamoto, Tsukuba, China, for an "apparatus, system, and method for wireless connection in integrated circuit packages."
The abstract of the patent published by the U.S. Patent and Trademark Office states: "Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed."
The patent application was filed on Dec. 22, 2011 (13/335,825). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=8,513,108.PN.&OS=PN/8,513,108&RS=PN/8,513,108
Written by Kusum Sangma; edited by Anand Kumar.